RF Module Terminal Layout for Compact Acoustic Wave Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As the number of radio frequency components increases on the mounting substrate with an external connection electrode, there is a need to reduce the size of these components while maintaining effective signal and ground terminal arrangements.
Innovation Solution
The radio frequency module design includes a mounting substrate with signal and ground terminals positioned on different main surfaces, allowing for a compact configuration by separating the signal terminals from the ground terminals, which are typically placed on the same surface in existing designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of radio frequency components mounted on the second main surface increases, then the functionality of the radio frequency module is improved, but the size of each radio frequency component must be reduced
Solution Approach 1:
The patent applies dimensionality change by moving the ground terminal from the third main surface to the fourth main surface (opposite side) of the radio frequency component. This spatial reconfiguration allows signal terminals and ground terminals to be positioned on different surfaces, effectively utilizing the three-dimensional space around the component. This enables more compact packaging and allows increased component density on the mounting substrate without increasing the size of individual radio frequency components.
2Device complexity
If signal terminal and ground terminal are placed on the same surface, then the connection structure is simplified, but the radio frequency component size increases
Solution Approach 1:
The invention resolves this contradiction by utilizing the fourth main surface (opposite to the third main surface) for the ground terminal. This separates signal and ground terminals into different spatial dimensions (different surfaces), allowing both terminals to be efficiently connected to the mounting substrate without requiring larger component footprint. The external connection electrode similarly spans between surfaces to connect both terminal types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a reduction in the overall size of the radio frequency components, improving packaging efficiency without compromising signal processing capabilities.
Implementation Method 1
An acoustic wave device according to an aspect of the present disclosure includes a piezoelectric substrate, an IDT electrode, a signal terminal, and a ground terminal
Data Source
AI summary
Reduced in size is a radio frequency component provided on a main surface of a mounting substrate on which an external connection electrode is disposed. A radio frequency module includes a mounting substrate, a first radio frequency component, and an external connection electrode. The mounting substrate has a first main surface and a second main surface opposed to each other. The first radio frequency component has a signal terminal and a ground terminal. The first radio frequency component is provided on the second main surface. The external connection electrode is provided on the second main surface. The first radio frequency component has a third main surface and a fourth main surface opposed to each other. The signal terminal is provided on the third main surface. The ground terminal is provided on the fourth main surface.