RF Receiver Test Signal Circuit with Impedance Transformation

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Solution Overview

Problem

Conventional test signal circuits for radio frequency receiver circuits in radar systems are inefficient in terms of semiconductor chip area usage and power savings, and struggle with sensitive power detection at low power levels due to their reliance on low impedance lines.

Innovation Solution

A test signal circuit with a voltage level detector capacitively coupled to a high impedance node, which generates a higher output sense voltage, and includes a modulator to transform a baseband test signal into a high frequency region, using impedance transforming elements to match impedances and a processor to generate control signals for optimizing the test signal generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional low impedance lines are used for power detection, then the detection circuit can be simpler, but the sensitivity for detecting low power levels deteriorates

Engineering Contradiction:
Improvepower detection sensitivityVSAvoiddetection circuit complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent changes the impedance parameter of the transmission line from conventional low impedance (50 ohm) to high impedance (100-200 ohm). This parameter change enables the voltage level detector to achieve higher sensitivity for detecting low power levels while maintaining acceptable circuit complexity through the use of standard high-impedance transmission line structures.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the conventional power detection method based on low impedance lines with a voltage level detection method using high impedance transmission lines. This substitution allows for more sensitive detection of low power levels by utilizing the voltage swing characteristics of high-impedance nodes rather than power-based detection.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Adaptability or versatility

If test signal circuit components are added to test RF receiver, then the testing capability is improved, but the semiconductor chip area increases

Engineering Contradiction:
Improvetesting capabilityVSAvoidsemiconductor chip area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent designs the test signal circuit to perform multiple functions: generating test signals, detecting voltage levels, and providing control signals for optimizing the RF receiver testing. By making the circuit multi-functional, the patent reduces the need for separate dedicated components, thereby improving testing capability while minimizing the semiconductor chip area consumption.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the test signal generation, voltage level detection, and control signal generation functions into an integrated circuit. The test signal generator, voltage level detector, and control circuit are merged into a single compact structure that can be implemented on a semiconductor chip, reducing the overall area required compared to separate discrete components.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If high impedance nodes are used for voltage level detection, then the voltage swing and detection sensitivity are improved, but the impedance matching becomes more complex

Engineering Contradiction:
Improvevoltage level detection accuracyVSAvoidimpedance matching complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent changes the impedance parameter of the transmission line from conventional low impedance to high impedance, which enables larger voltage swings and improved detection sensitivity. The patent manages the impedance matching complexity by using standard high-impedance transmission line structures and carefully designing the connection points between different impedance domains.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution enables highly efficient use of semiconductor chip area, achieves power savings, and allows for sensitive power detection even at low power levels, improving the accuracy of radio frequency receiver circuit parameter testing.

Implementation Method 1

a voltage level detector capacitively coupled to a high impedance node which results in a high voltage swing

Methodology Applied
Scientific EffectCapacitive coupling: Capacitance

Implementation Method 2

a modulator configured to modulate a local oscillator signal with the baseband test signal to generate a test signal

Methodology Applied
Scientific EffectModulation: Phase Modulation

Implementation Method 3

the impedance transforming element configured to lower a first impedance level of the first transmission element to a second impedance level of the second transmission element

Methodology Applied
Scientific EffectImpedance transformation: Electrical Impedance Tomography

Data Source

PatentUS20240426898A1Test signal circuit for testing a radio frequency receiver circuit, a semiconductor chip and a system comprising the test signal circuit
Publication Date: 2024.12.26 INFINEON TECHNOLOGIES AG
  • US20240426898A1 patent drawing
  • US20240426898A1 patent drawing
  • US20240426898A1 patent drawing

AI summary

Test signal circuit for testing a radio frequency receiver circuit, including: a test signal generator configured to generate a baseband test signal, a modulator configured to modulate a local oscillator signal with the baseband test signal to generate a test signal, a first transmission element coupled between the modulator and an input of an impedance transforming element, a second transmission element coupled to an output of the impedance transforming element, the impedance transforming element configured to lower a first impedance level of the first transmission element to a second impedance level of a second transmission element, a voltage level detector coupled to the first transmission element, the voltage level detector being configured to detect a voltage level of the test signal. The disclosure further relates to a semiconductor chip including the test signal circuit and a system including the test signal circuit and a control circuit.