Non-Contact RF Test System for Electronic Device Fault Detection
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Solution Overview
Problem
Existing methods for testing electronic device structures often fail to detect faults until after assembly is complete, leading to costly device scrapping or extensive reworking due to the difficulty in identifying improper connections and manufacturing errors in conductive structures like antennas, connectors, and welds during the assembly process.
Innovation Solution
A non-contact test system using a vector network analyzer and wireless probe to transmit and receive radio-frequency signals, allowing for the detection of faults in electronic device structures before or after assembly by analyzing complex impedance and forward transfer coefficient measurements, which can identify issues such as improper connections and manufacturing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional testing methods are used on finished devices, then testing can be performed, but faults cannot be detected early enough leading to costly scrapping or reworking
Solution Approach 1:
The patent applies preliminary action by enabling fault detection during the manufacturing process itself, before the device is fully assembled and tested. The non-contact test system allows operators to identify faults in conductive structures, welds, and connections while they are still being formed, rather than waiting for final assembly. This early detection capability enables timely intervention to correct or scrap defective parts, preventing costly rework and waste.
2Productivity
If non-contact testing is implemented, then early fault detection is enabled, but test system complexity increases
Solution Approach 1:
The patent replaces traditional mechanical contact-based testing methods with a non-contact electromagnetic testing system. The test system uses radio-frequency signals transmitted through air or vacuum to interact with conductive structures, eliminating the need for physical contact between test equipment and tested components. This substitution enables testing of complex three-dimensional structures and difficult-to-reach areas without requiring disassembly or specialized access, thereby improving productivity despite the advanced nature of the test system.
3Ease of operation
If contact-based testing is used, then simple test equipment can be used, but access to difficult-to-reach conductive structures is limited
Solution Approach 1:
The patent introduces an intermediary medium (air or vacuum) that allows electromagnetic test signals to propagate without requiring physical contact between the test equipment and the conductive structures being tested. The non-contact test system uses radio-frequency waves as intermediaries to interact with conductive structures through air gaps, enabling testing of difficult-to-reach areas, hidden connections, and complex three-dimensional geometries that would be inaccessible to traditional contact-based testing methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables early detection of faults during the manufacturing process, allowing for timely reworking or scrapping of parts, thereby reducing waste and rework costs by providing accurate and revealing tests on electronic device structures before they become fully assembled devices.
Implementation Method 1
The antenna probe may include one or more test antennas for transmitting the radio-frequency test signals. During testing, the test antennas may be placed in the vicinity of corresponding structures to be tested such as electronic device antennas, connectors, structures with welds, electronic components, conductive housing structures, conductive traces, conductive surfaces on housing structures or other device structures, device structures including dielectric layers, structures with solder joints, and other structures. The antenna probe may use the test antennas to receive corresponding radio-frequency signals from the device structures under test.
Implementation Method 2
The transmitted and reflected radio-frequency test signals may be analyzed to produce complex impedance measurements and complex forward transfer coefficient measurements. These measurements or other gathered test data may be compared to previously obtained baseline measurements on properly assembled structures to determine whether the electronic device structures under test contain a fault.
Data Source
AI summary
Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.