RF Transducer Package with Local Calibration Memory
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing RF sensor systems for monitoring harmonic content in semiconductor manufacturing face challenges such as calibration dependencies between transducer and analysis packages, inability to independently replace components, lack of self-bias voltage monitoring, inadequate shielding for inductive transducers, and limitations in end-point detection and diagnostics of RF power delivery networks.
Innovation Solution
A system comprising a voltage transducer, current transducer, and memory device for local calibration, enabling independent replacement of transducer packages without recalibration, DC coupled voltage sampling for self-bias voltage measurement, effective shielding for inductive transducers, and non-frequency discriminating end-point detection with modular diagnostic capabilities for RF power delivery networks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If transducer packages are specifically calibrated to work with corresponding analysis and communications packages, then measurement precision is improved, but device complexity and maintenance difficulty increase due to inability to independently replace components
Solution Approach 1:
The system is divided into separate transducer package and analysis/communications package components that can be independently replaced. The transducer package includes voltage and current transducers with associated calibration data, while the analysis package performs harmonic analysis. This segmentation allows independent maintenance and replacement of each component without affecting the other.
Solution Approach 2:
The system uses standardized interface parameters and calibration data formats that enable different transducer packages to work with different analysis packages. Calibration data is stored in a standardized format that can be transferred and applied across different package combinations, maintaining measurement precision while enabling component independence.
2Productivity
If downtime is minimized for expensive semiconductor processing lines, then productivity is improved, but system reliability worsens due to fatal maintenance and support issues with existing RF sensor systems
Solution Approach 1:
The transducer package is designed as a self-contained modular unit with integrated calibration data that can be quickly swapped without system recalibration. This modular design enables rapid maintenance operations that minimize processing line downtime while maintaining system reliability through consistent calibrated measurements.
Solution Approach 2:
Calibration data is pre-loaded into the transducer package during manufacturing, eliminating the need for field recalibration when components are replaced. This preliminary calibration action ensures that the system remains reliable and accurate immediately after component replacement, without requiring maintenance downtime for recalibration procedures.
3Measurement precision
If inductive transducers are exposed to RF current carriers for measurement, then measurement capability is improved, but harmful factors increase due to stray electric and magnetic fields causing crosstalk
Solution Approach 1:
A shielded housing structure serves as an intermediary between the inductive transducer and the external environment. The housing includes electric shields (conductive barriers) and magnetic shields (mu-metal or ferrite materials) that mediate the interaction between the transducer and stray fields, blocking harmful interference while allowing the transducer to perform its measurement function.
Solution Approach 2:
The harmful stray fields are extracted or blocked from the transducer environment through shielding structures. The housing design removes the influence of external electric and magnetic fields by placing conductive and magnetic barriers between the transducer and the RF current carrier, isolating the measurement process from interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates field replacement of RF sensor components without recalibration, allows simultaneous measurement of RF voltage and self-bias voltage, protects inductive transducers from stray fields, and provides efficient end-point detection and network diagnostics, reducing maintenance costs and downtime in semiconductor processing.
Implementation Method 1
a voltage transducer adapted to sample the voltage of the RF signal and to output a first signal representative of the voltage
Implementation Method 2
a current transducer adapted to sample the current of the RF signal and to output a second signal representative of the current
Implementation Method 3
a shielded housing adapted to protect the inductive transducer from stray electric and magnetic fields which will result in crosstalk
Implementation Method 4
an inductive transducer, and a shielded housing... the inductive transducer is mounted within the shielded housing in magnetic proximity to the RF current carrier
Data Source
AI summary
A system (10) is provided herein for monitoring the harmonic content of the RF signal delivered to an RF powered device (13). The system comprises (a) a voltage transducer (16) adapted to sample the voltage of the RF signal and to output a first signal representative thereof, (b) a current transducer (17) adapted to sample the current of the RF signal and to output a second signal representative thereof, and (c) a memory device (67) in communication with at least one, and preferably both, of the aforementioned transducers 16 and 17 and which contains calibration information specific to the transducers.