RF Power Transistor Heat Spreader Eutectic Bonding

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Solution Overview

Problem

The cost-intensive and complex process of packaging semiconductor components, particularly in removing heat from semiconductor dies, poses a challenge in reducing manufacturing costs while maintaining performance.

Innovation Solution

A semiconductor package design featuring a heat spreader coupled to the semiconductor die using eutectic bonding, with a plastic packaging material that encapsulates the die and leads, providing a low thermal resistance path for heat dissipation and enhancing breakdown voltage through strategic placement and dielectric materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional semiconductor packaging is used to protect the die and remove heat, then the semiconductor component is protected from environmental stresses and heat is dissipated, but the manufacturing cost and complexity increase

Engineering Contradiction:

Improveprotection from environmental stressesVSAvoidpackaging complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple packaging functions into a single integrated structure. The leadframe serves simultaneously as the protective package body, the heat dissipation path, and the electrical connection interface. This merging eliminates the need for separate protective housing, heat sink, and connection elements, thereby reducing manufacturing complexity while maintaining reliability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The leadframe is designed to perform multiple functions: it provides mechanical protection for the die, conducts heat away from the die through its thermally conductive structure, and provides electrical connections to external circuits. This multi-functionality reduces the number of components needed and simplifies the overall packaging structure

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If traditional semiconductor packaging is used to remove heat from the die, then heat dissipation is achieved, but the manufacturing cost increases

Engineering Contradiction:

Improveheat removal efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The leadframe structure is designed to inherently provide heat dissipation functionality through its own thermal conductivity and geometry. The heat spreader portion of the leadframe automatically conducts heat from the die without requiring additional active cooling components or complex thermal management systems, thereby reducing manufacturing cost while maintaining effective heat removal

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent utilizes the leadframe material's inherent thermal properties to recover and dissipate heat that would otherwise be wasted. By designing the leadframe to act as a heat sink and heat spreader, the system recovers thermal energy management functionality from what would traditionally be a simple electrical connection element, reducing the need for additional heat dissipation components

Inventive Principle:

Principle #34Discarding and recovering

3Reliability

If complex packaging features are added to provide protection and heat removal, then reliability is improved, but the manufacturing process becomes more costly

Engineering Contradiction:

Improveprotection and heat removalVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The leadframe is segmented into distinct functional zones: a die attachment portion for securing the semiconductor die, a heat spreader portion for thermal management, and lead portions for electrical connections. This segmentation allows each zone to be optimized for its specific function while being manufactured as a single integrated component, reducing overall manufacturing cost compared to assembling multiple separate parts

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces manufacturing costs by using a cost-effective plastic packaging material while improving thermal and electrical performance, maintaining low interelectrode capacitance and high breakdown voltage, and facilitating efficient heat removal.

Implementation Method 1

A semiconductor package design featuring a heat spreader coupled to the semiconductor die using eutectic bonding

Methodology Applied

Scientific EffectEutectic bonding:

Implementation Method 2

providing a low thermal resistance path for heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7605451B2RF power transistor having an encapsulated chip package

Publication Date: 2009.10.20 XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY

AI summary

In various embodiments, semiconductor components and methods to manufacture semiconductor components are disclosed. In one embodiment, a method to manufacture semiconductor components includes attaching multiple heat spreaders to a semiconductor wafer. Other embodiments are described and claimed.