RFID Chip Module Laser Reflow Soldering Through Carrier
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Solution Overview
Problem
Existing methods for manufacturing RFID labels with RFID chip modules on textile substrates are inefficient and lack reliability in terms of high throughput and consistent connection between the chip module and the substrate's metallization structure.
Innovation Solution
The chip module is designed with a metallization structure on its bottom side, allowing for laser reflow soldering by guiding laser beams through its body to the substrate, which reflows solder material and forms a reliable connection, enhancing processing speed and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional soldering methods are used to connect RFID chip modules to textile substrates, then manufacturing throughput is limited, but connection reliability is maintained
Solution Approach 1:
The patent replaces traditional mechanical soldering methods with laser-based reflow soldering. The laser beam directly heats the solder material through the carrier, enabling rapid melting and reflow without mechanical contact, thereby significantly increasing manufacturing throughput while reducing processing time
Solution Approach 2:
The invention utilizes the phase transition of solder material from solid to liquid state through laser-induced heating. The laser energy causes the solder to melt and reflow, forming reliable connections quickly, which accelerates the manufacturing process while maintaining connection quality
2Speed
If laser beams are guided through the carrier body for reflow soldering, then processing speed increases, but energy absorption by the carrier material may occur
Solution Approach 1:
The patent applies local quality by creating a transparent window area in the carrier material where laser beams can pass through with minimal absorption. This localized modification allows selective energy transmission to the solder material while maintaining the structural integrity of the carrier body
Solution Approach 2:
The transparent window acts as an intermediary that facilitates laser energy transmission from the light source to the solder material. It mediates the energy transfer by allowing selective passage of laser wavelengths while blocking absorption by the opaque carrier material
3Use of energy by moving object
If the carrier material is made transparent to laser wavelengths, then energy transmission to solder material improves, but material selection and manufacturing complexity increase
Solution Approach 1:
The patent segments the carrier into two distinct functional zones: an opaque body providing structural support and a transparent window providing laser energy transmission. This segmentation allows each zone to be optimized for its specific function while simplifying overall design and manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables fast, efficient, and reliable soldering of RFID chip modules to textile substrates, improving manufacturing throughput and ensuring consistent electrical connectivity for RFID labels.
Implementation Method 1
The energy of the laser beams may be deposited mainly at the metallization structure in order to reflow soldering material arranged on the metallization structure
Implementation Method 2
the carrier may comprise a material which is transparent to visible, UV, and/or infrared light. This provides the advantage that the energy of laser beams used for laser reflow soldering are not or not substantially absorbed in the carrier material
Data Source
AI summary
A chip module comprises a carrier, having a first main surface and a second main surface opposite to the first main surface. A first recess structure is arranged in the carrier in the first main surface, and a chip is arranged in the first recess structure of the carrier. A patterned metallization layer is deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure. The chip is electrically connected to the first metallization structure and the second metallization structure. The chip module comprises in particular an RFID chip and is suited to be connected to a textile substrate by way of laser reflow soldering.