RGB LED Chip Lens Layout for Uniform Light Distribution
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Solution Overview
Problem
Current LED packaging techniques face challenges in achieving consistent light distribution and RGB display due to variations in LED chip spacing and position deviations during the die bonding process, leading to poor heat dissipation and short service life in large display devices.
Innovation Solution
The proposed LED device includes at least three LED chips spaced apart with an encapsulation layer covering their lateral surfaces and filling gaps between them, along with a lens disposed on the first surface of each chip. This configuration allows for precise control of light emitting angles and improved light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If lead-type packaging is used for LED chips, then mechanical protection is provided, but packaging thermal resistance increases (higher than 100 K/W) and heat dissipation deteriorates
Solution Approach 1:
The patent changes the packaging structure from lead-type to a new configuration where LED chips are mounted on a substrate with specific thermal and optical properties. The packaging structure parameters are optimized to reduce thermal resistance while maintaining mechanical protection, achieving thermal resistance below 100 K/W through improved heat dissipation pathways.
2Manufacturing precision
If LED chips are spaced apart by not less than 50 μm during die bonding, then position deviation is reduced, but the light emitting center of R/G/B chips becomes difficult to coincide with the optical axis of the lens, leading to great difference in light emitting angle
Solution Approach 1:
The patent applies preliminary positioning actions during the mounting process, using precise positioning structures and methods to pre-establish the correct spatial relationship between LED chips and lenses before final bonding. This preliminary positioning ensures that the light emitting centers of R/G/B chips coincide with the optical axes of the lenses, achieving consistent light emitting angles while maintaining adequate spacing for manufacturing tolerance.
3Productivity
If LED chips are mounted with spacing not less than 50 μm, then integration is improved, but service life decreases due to poor heat dissipation
Solution Approach 1:
The patent optimizes the spacing parameter between LED chips to a specific range that simultaneously achieves high integration and effective heat dissipation. By changing the spacing parameter from the conventional minimum of 50 μm to an optimized value, the patent improves both integration density and thermal management, thereby extending service life while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables consistent light emitting angles and improved light distribution, enhancing the reliability and service life of LED devices, particularly in large display applications such as outdoor traffic signal indicators.
Implementation Method 1
The encapsulation layer covers the lateral surface of each of the LED chips, and fills gaps between the LED chips
Implementation Method 2
The lens is disposed on the first surface of each of the LED chips, and covers the light emitting region of the LED chips
Data Source
AI summary
A light emitting diode (LED) device includes at least three LED chips spaced apart from one another, an encapsulation layer and a lens. Each of the LED chips is configured to emit light having a respective one of wavelengths. The LED chips cooperate to have a light emitting region. Each LED chip has a first surface, a second surface opposite to the first surface, and a lateral surface that interconnects the first and second surfaces. The encapsulation layer covers the lateral surface of each of the LED chips, and fills gaps between the LED chips. The lens is disposed on the first surface of each of the LED chips, and covers the light emitting region of the LED chips.