Integrated RGB LED Package Layout for Compact Independent Driving
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Solution Overview
Problem
Existing light emitting diode (LED) devices have complex manufacturing processes and require separate production and mounting of individual color LEDs, making them difficult to integrate into simple and compact devices.
Innovation Solution
A light emitting device package with a simple structure featuring a printed circuit board, epitaxial stacks emitting different wavelengths, and a molding layer that partially reflects, scatters, or absorbs external light, allowing for the integration of multiple colors in a small area with a simplified manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If individual color LEDs are produced and mounted separately, then each LED can be optimized for its specific wavelength, but the manufacturing process becomes complex and integration into compact devices becomes difficult
Solution Approach 1:
The patent combines multiple individual LED structures (red, green, blue LEDs) into a single integrated light emitting device. The LED device includes multiple light emitting structures disposed on the same substrate, allowing different wavelength lights to be emitted from one unified component rather than requiring separate production and mounting of individual LEDs.
Solution Approach 2:
The integrated LED device performs multiple functions within a single structure - it can emit red light, green light, and blue light simultaneously or independently. The device includes multiple light emitting structures that can be selectively activated to produce different colors, making it a multi-functional light source that replaces what would traditionally require multiple separate LEDs.
2Adaptability or versatility
If multiple individual LEDs are mounted separately, then each LED can function independently, but the device size increases and compact integration becomes difficult
Solution Approach 1:
The patent implements a nested structure where multiple light emitting structures are integrated within a single LED device package. The red, green, and blue light emitting structures are disposed in close proximity on the same substrate, with their light emitting regions overlapping or adjacent to each other, creating a compact nested arrangement that reduces overall device volume.
Solution Approach 2:
The patent utilizes vertical stacking and overlapping of light emitting regions in the vertical dimension rather than only horizontal placement. The light emitting structures are arranged with overlapping active layers at different heights, allowing multiple colors to be integrated in a three-dimensional configuration that minimizes the horizontal footprint and reduces device size.
3Ease of manufacture
If a simple LED structure is used, then manufacturing is easier, but the ability to integrate multiple colors in a small area is reduced
Solution Approach 1:
The patent divides the integrated LED device into distinct light emitting structures (red LED structure, green LED structure, blue LED structure), each with its own active layer and electrode connections. This segmentation allows each color component to be manufactured and optimized independently while maintaining overall integration, balancing manufacturing simplicity with integration precision.
Solution Approach 2:
The patent applies different structural configurations to different regions of the device - each light emitting structure has its own optimized active layer thickness, material composition, and electrode arrangement tailored to its specific wavelength requirements. The bump electrodes are selectively positioned and connected to specific light emitting structures, allowing local optimization while maintaining overall device integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of high-resolution, compact light emitting devices with simplified manufacturing, where multiple colors can be integrated in a small area, facilitating their use in display and vehicle lighting applications.
Implementation Method 1
the molding layer covers an upper surface of the substrate and partially reflect, scatter, or absorb external light
Implementation Method 2
the molding layer covers an upper surface of the substrate and partially reflect, scatter, or absorb external light
Implementation Method 3
the molding layer covers an upper surface of the substrate and partially reflect, scatter, or absorb external light
Implementation Method 4
at least one light emitting device disposed on the front surface and emitting light
Data Source
AI summary
A light emitting device module including a printed circuit board, upper and lower electrodes disposed on opposing surfaces of the printed circuit board, light emitting devices configured to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting devices, in which each light emitting device includes a light emitting structure, a substrate disposed on the light emitting structure, and bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers side surfaces of the substrates, a number of the lower electrodes is less than a number of the bump electrodes of the plurality of light emitting devices, and each of the light emitting devices is configured to be driven independently.