RGB LED Package Coupling Structure for High-Density Display Mounting
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Solution Overview
Problem
Light emitting diodes (LEDs) with large luminous areas face low current density, leading to inefficiency, while those with small areas are difficult to mount and replace due to their size, posing challenges in display apparatus manufacturing and repair.
Innovation Solution
A display apparatus using light emitting diode packages with small luminous areas, where blue, red, and green LEDs are integrated with a coupling structure and substrate electrodes, allowing for high current density and improved yield in mounting and repair, utilizing materials like polydimethylsiloxane (PDMS) and polyimide for insulation and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If light emitting diodes with large luminous area are used, then mounting and replacement is easier, but current density decreases leading to low luminous efficacy
Solution Approach 1:
The invention divides the light emitting diode system into separate color components (red, green, blue LEDs) mounted on a common substrate. Each LED chip maintains a small luminous area for high current density and efficiency, while the collective package provides a larger effective mounting area. This segmentation allows each LED to operate optimally while simplifying overall mounting and replacement procedures.
2Loss of energy
If light emitting diodes with small luminous area are used, then luminous efficacy increases, but mounting and replacement becomes difficult
Solution Approach 1:
The invention combines multiple small-sized LED chips (red, green, and blue) onto a single substrate to form an integrated light emitting diode package. This merging approach maintains the small luminous area of individual chips for high current density and luminous efficacy, while the integrated package provides a larger effective size that simplifies mounting and replacement operations. The package structure allows handling at the package level rather than individual chip level.
3Productivity
If multiple light emitting diodes are integrated in one package, then manufacturing yield improves, but device complexity increases
Solution Approach 1:
The invention performs preliminary assembly of multiple LED chips onto a substrate within the package structure during manufacturing. By pre-assembling the multi-color LED package with all necessary electrical connections and optical elements before final installation, the system achieves higher manufacturing yield through batch processing. The preliminary integration of multiple chips into a single replaceable unit simplifies quality control and reduces the complexity of field replacements, despite the increased internal package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high current density in LEDs with small luminous areas, enhancing manufacturing and repair efficiency by increasing the size of the light emitting diode package relative to the chip, thus improving yield and reducing costs.
Implementation Method 1
the blue light emitting diode chip, the red light emitting diode part and the green light emitting diode chip are covered by a coupling structure
Implementation Method 2
a plurality of first substrate electrodes and a plurality of second substrate electrodes disposed on the substrate and each electrically connected to each of the blue light emitting diode chip, the red light emitting diode part and the green light emitting diode chip
Data Source
AI summary
A display apparatus and a method of manufacturing the same. The display apparatus includes a circuit board; and a plurality of pixels formed on the circuit board, wherein at least one of a blue light emitting diode chip, a red light emitting diode part, and a green light emitting diode chip is disposed in each of the pixels, and the blue light emitting diode chip, the red light emitting diode part and the green light emitting diode chip are covered by a coupling structure.