Rigid Flex Board Module High-Density Interconnect Design
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Solution Overview
Problem
Conventional rigid flex board modules face challenges in achieving high-density circuitry due to poor installation of high-density interconnected circuit boards, leading to reduced yield and efficiency.
Innovation Solution
A rigid flex board module design that includes a flexible circuit board, a first and second rigid circuit board, and a high-density interconnected circuit board, where the high-density circuit board is separately designed and disposed within the module, allowing for improved circuitry density and reduced installation issues through the use of conductive posts and multi-layer circuit layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a high-density interconnected circuit board is integrated into the rigid flex board module, then circuit density is improved, but installation difficulty increases leading to reduced yield
Solution Approach 1:
The circuit board system is divided into separate rigid and flexible portions with distinct circuit layers. The rigid circuit board contains high-density interconnected circuits while the flexible circuit board provides connectivity, allowing each to be optimized independently for their respective functions and assembly requirements.
Solution Approach 2:
An adhesive layer serves as an intermediary component between the rigid circuit board and flexible circuit board. This mediator facilitates reliable bonding and electrical connection while accommodating the different mechanical properties of rigid and flexible substrates, thereby improving assembly yield.
2Ease of manufacture
If conventional rigid flex board design is used, then manufacturing is simpler, but high-density circuitry cannot be achieved
Solution Approach 1:
The circuit board is segmented into rigid and flexible portions with separate circuit layers. This segmentation enables the rigid portion to accommodate high-density interconnected circuits while the flexible portion maintains manufacturing simplicity through conventional flexible PCB processes.
Solution Approach 2:
The flexible circuit board is positioned and bonded within the rigid circuit board structure. This nesting arrangement allows the high-density rigid circuit board to provide the necessary circuit density while the flexible circuit board integrates seamlessly into the assembly without complicating the overall manufacturing process.
Data Source
AI summary
A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.