Wiring Substrate Carrier Release with a Tuned Rigid Plate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for releasing carriers in coreless build-up methods face issues such as substrate bending, disconnection, peeling, and chemical interference, leading to unreliable and damaging carrier removal.
Innovation Solution
A method involving a laminated sheet with a release layer and wiring layer, forming a release starting portion, and using a rigid plate with specific flexural modulus and hardness to easily and reliably separate the carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a conventional carrier release method is used, then the carrier can be removed, but the wiring layer bends greatly causing disconnection and peeling
Solution Approach 1:
The patent changes the physical parameters of the release tool by specifying a rigid plate with a flexural modulus of 0.3-300 GPa and Rockwell hardness of R135 or less. These parameter specifications ensure the plate is rigid enough to apply controlled force for carrier release without being so rigid that it causes substrate bending or cracking, thus resolving the contradiction between ease of carrier removal and wiring layer integrity
Solution Approach 2:
The rigid plate serves as an intermediary tool between the operator and the wiring layer-carrier assembly. It mediates the release process by providing controlled mechanical force that separates the carrier from the wiring layer without directly applying excessive force to the wiring layer itself, preventing bending and disconnection while enabling reliable carrier removal
2Productivity
If a rigid tool is used for carrier release, then carrier separation is effective, but substrate cracking occurs
Solution Approach 1:
The patent specifies precise parameter ranges for the rigid plate: flexural modulus of 0.3-300 GPa and Rockwell hardness of R135 or less. These parameters ensure the plate has sufficient rigidity for effective carrier separation while avoiding excessive rigidity that would cause substrate cracking, thus balancing productivity with substrate integrity
Solution Approach 2:
By pre-specifying the flexural modulus and hardness ranges of the rigid plate, the patent provides beforehand cushioning against substrate cracking. The plate's controlled rigidity acts as a buffer, allowing effective carrier release while preventing excessive stress concentration that would crack the substrate
3Ease of operation
If chemical solution is attached to the knife for carrier release, then release is facilitated, but chemical interference with metal etching occurs
Solution Approach 1:
The patent replaces the chemical-based release method (attaching chemical solution to a knife) with a purely mechanical approach using a rigid plate. The rigid plate's controlled rigidity enables carrier release through mechanical force alone, eliminating the need for chemical solutions and thus preventing chemical interference with subsequent metal etching processes
Data Source
AI summary
A method for manufacturing a wiring substrate includes: providing a laminated sheet that includes a release layer and a wiring layer in order on a carrier; forming a step or gap between the wiring layer and the carrier as a release starting portion; inserting a rigid plate having a long portion to the release starting portion from the long portion, wherein the long portion is longer than a width of the laminated sheet; and moving the rigid plate from the release starting portion along the release layer, thereby developing release of the wiring layer from the carrier, wherein the wiring layer has a flexural modulus at 25° C. measured in accordance with JIS K6911-1995 of 0.3 GPa or more and 300 GPa or less.