Ring-Shaped Packaging Planarization Units for OLED Bonding Strength
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Solution Overview
Problem
The existing room temperature bonding technique for OLED display panels faces challenges in packaging yield due to dust or defects on the surface of the packaging planarization layer, which can adversely affect the bonding process and lead to reduced strength and increased probability of fracture.
Innovation Solution
The array substrate features a packaging region with a packaging planarization layer comprising multiple ring-shaped packaging units that surround the display region, increasing the contact area and bonding strength between the room temperature bonding layers, while independent unit structures minimize the impact of surface defects, and the packaging planarization layer is formed using materials like polyimide, phenol, or epoxy resins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a packaging planarization layer is formed using conventional techniques, then the surface should be flat for bonding, but dust or defects on the surface reduce bonding strength and increase fracture probability
Solution Approach 1:
The packaging planarization layer is divided into multiple independent planarization units, each forming a separate bonding interface. This segmentation ensures that defects or dust in one unit do not affect the bonding strength of other units, thereby maintaining overall bonding reliability while achieving surface flatness through localized planarization.
2Stability of the object's composition
If the packaging planarization layer is made as a single continuous structure, then it provides uniform planarization, but defects can propagate across the entire structure reducing overall bonding strength
Solution Approach 1:
The continuous packaging planarization layer is segmented into multiple independent planarization units. Each unit maintains uniform planarization locally, while the independence of units prevents defect propagation, thereby preserving both uniform planarization and bonding strength.
Solution Approach 2:
Each planarization unit is designed with specific local properties optimized for its function. The units can have different dimensions, shapes, or material compositions tailored to local requirements, allowing uniform planarization in each zone while maintaining overall bonding strength through the collective contribution of all units.
3Ease of manufacture
If room temperature bonding is used for packaging, then the process is simpler and lower cost, but bonding strength is reduced and fracture probability increases
Solution Approach 1:
The bonding interface is segmented into multiple planarization units, which increases the total bonding area. This compensation through area increase offsets the reduced bonding strength inherent in room temperature bonding processes, maintaining adequate overall bonding strength while preserving process simplicity.
Solution Approach 2:
The invention changes the geometric parameters of the bonding interface by creating multiple planarization units with specific dimensions and arrangements. This parameter optimization enhances the bonding area and distribution, compensating for the lower bonding strength of room temperature processes without requiring additional heating or complex processing.
Data Source
AI summary
An array substrate and manufacturing method thereof, display panel and display device are disclosed. The array substrate includes a display region and a packaging region surrounding the display region. The packaging region is provided with a packaging planarization layer, the packaging planarization layer includes a plurality of packaging planarization units, and each of the packaging planarization units is formed as a ring shaped pattern in the packaging region and configured to surround the display region.