Ring-Shaped Support Member for Substrate Processing
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Solution Overview
Problem
Existing substrate processing methods are inefficient due to time-consuming circular cutting of the outer periphery and require additional steps for surface preparation, leading to reduced productivity and potential damage during the removal of reinforcing members.
Innovation Solution
A method involving bonding a ring-shaped support member to the substrate's outer periphery, allowing simultaneous processing of both surfaces, and using adhesives or tapes with UV light or heat-releasable properties for efficient separation without damage, reducing the need for cutting and minimizing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ring-shaped reinforcing portion is formed on the outer periphery of the wafer and then cut and removed by cutting blade, then the wafer can be processed on both surfaces, but the work for cutting the outer periphery requires time and reduces productivity
Solution Approach 1:
The reinforcing member is designed as a ring-shaped component that can be easily separated from the wafer. The ring shape allows it to be segmented or divided into sections that can be removed individually or as a whole, reducing the time and complexity of removal compared to cutting the entire outer periphery.
Solution Approach 2:
The reinforcing member is extracted as a separate component from the wafer structure. Instead of being integrated into the wafer material, it is applied as a distinct element that can be easily removed after serving its protective function during processing.
2Ease of manufacture
If the wafer is cut by cutting blade to divide into individual devices, then the dicing process can be completed, but the outer periphery cutting increases processing time
Solution Approach 1:
The ring-shaped reinforcing member is positioned on the wafer outer periphery before the dicing process begins. This preliminary placement allows the cutting blade to follow a predetermined path along the ring, making the cutting operation more efficient and reducing the time required for dicing.
3Reliability
If additional cleaning steps are performed to remove contaminants from substrate surfaces, then contamination can be reduced, but processing time increases
Solution Approach 1:
The ring-shaped reinforcing member serves as a temporary, disposable component that protects the wafer during processing. After serving its purpose, it is easily removed and discarded, taking with it any contaminants that may have accumulated on the wafer surface during the process, eliminating the need for additional cleaning steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances productivity by allowing simultaneous processing of both surfaces, reduces the risk of substrate damage during separation, and eliminates the need for additional cleaning steps, while enabling high-temperature processing with heat-resistant adhesives.
Implementation Method 1
bonded to the substrate via an adhesive or an adhesive tape
Implementation Method 2
adhesive or an adhesive tape releasable by irradiation of UV light
Implementation Method 3
adhesive or an adhesive tape releasable by heating
Data Source
AI summary
A processing method of a substrate which includes: a first bonding step which bonds a ring-shaped first support member to a first surface of the substrate along the outer periphery of the substrate; a first processing step which processes the substrate; and a first separating step which separates the first support member from the substrate by separation at the bonded position.