Ring Structure Suppresses Electromagnetic Radiation in ICs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of integrated circuits exacerbates electromagnetic radiation coupling between inductors and wires, particularly at high frequencies, leading to performance issues in integrated circuits.
Innovation Solution
An electronic device is designed with a first semiconductor die and a substrate featuring conductive features and bumps that form a ring structure, which reduces electromagnetic radiation coupling by inducing an inverse magnetic field to suppress radiation passing through the subspace formed by these structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If integrated circuits are miniaturized to reduce size, then device dimensions are reduced, but electromagnetic radiation coupling between inductors and wires increases
Solution Approach 1:
The patent introduces a ring structure as an intermediary element between inductors and wires. This ring structure generates an inverse magnetic field that acts as a mediator to counteract the harmful electromagnetic radiation coupling, thereby reducing the harmful effects without changing the miniaturized dimensions of the integrated circuit.
Solution Approach 2:
The ring structure is designed to generate an inverse magnetic field in advance that opposes and cancels out the electromagnetic radiation from inductors and wires. This preliminary anti-action prevents the harmful coupling effects from manifesting, allowing miniaturization to proceed without suffering from increased electromagnetic interference.
2Productivity
If distance between inductors is reduced for miniaturization, then integrated circuit density increases, but coupling phenomenon between inductors becomes more apparent
Solution Approach 1:
The ring structure serves as an intermediary that generates an inverse magnetic field to counteract the coupling phenomenon between closely-spaced inductors. This allows inductors to be positioned closer together for higher density while the ring structure mediates to eliminate the harmful coupling effects.
Solution Approach 2:
The patent converts the harmful coupling phenomenon into a beneficial effect by using the ring structure to generate an inverse magnetic field. The same proximity that causes coupling is now utilized to enhance the shielding effect, turning the harmful interaction into a protective mechanism that reduces electromagnetic interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ring structure effectively reduces electromagnetic radiation coupling, enhancing the operational efficiency of the electronic device by lowering coupling values among inductors, as demonstrated by experimental data showing a reduction of about 4 dB in coupling values.
Implementation Method 1
the first conductive feature, the bumps, and the second conductive feature are configured to form at least one ring structure... reduces electromagnetic radiation coupling by inducing an inverse magnetic field
Data Source
AI summary
An electronic device includes a first semiconductor die, a plurality of bumps, and a substrate. The first semiconductor die includes a first conductive feature. The bumps are disposed on the first semiconductor die and are connected to the first conductive feature. The substrate includes a second conductive feature. The bumps are electrically connected to the second conductive feature. The first conductive feature, the bumps, and the second conductive feature are configured to form at least one ring structure.