Robot Arm Substrate Holding Device Vacuum Clamping
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Solution Overview
Problem
Conventional substrate holding devices under vacuum conditions fail to securely hold glass substrates during high-speed operations, leading to sliding and potential damage, and result in prolonged production times due to alignment issues.
Innovation Solution
A substrate holding device equipped with robot arms and substrate holding modules featuring linear guide mechanisms and electromagnetic modules, which apply magnetic forces to clamp and release the substrate, ensuring secure holding and high-speed operation without sliding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum adsorption method is used to hold substrate, then substrate can be securely held, but this method cannot be used under vacuum condition
Solution Approach 1:
The patent replaces the vacuum adsorption method (which relies on pressure differential) with a mechanical clamping system using clamping members that physically constrain the substrate. This mechanical approach works effectively under vacuum conditions where pressure differential methods fail.
Solution Approach 2:
The invention changes the holding mechanism from pressure-based (vacuum adsorption) to position-based (mechanical clamping). The clamping members can be positioned at specific locations on the substrate to provide secure holding without relying on atmospheric pressure differences.
2Adaptability or versatility
If stop mechanism is used to block substrate, then substrate can be held without vacuum adsorption, but substrate is easy to slide and alignment time is prolonged
Solution Approach 1:
The patent employs multiple clamping members distributed at different locations on the substrate (e.g., four corners or edges). This localized clamping approach prevents sliding more effectively than a single stop mechanism while maintaining compatibility with vacuum conditions.
Solution Approach 2:
The holding function is segmented into multiple independent clamping members rather than using a single stop mechanism. Each clamping member independently constrains the substrate at its location, collectively preventing sliding and improving alignment precision.
3Productivity
If operating speed is increased to improve productivity, then production time is reduced, but risk of substrate flying out and causing damage is greatly increased
Solution Approach 1:
The clamping members are designed to dynamically adjust and maintain firm contact with the substrate during high-speed operation. The mechanical clamping system provides stable constraint that prevents substrate displacement even at increased operating speeds, unlike static stop mechanisms.
Solution Approach 2:
The substrate is clamped securely by the clamping members before high-speed operation begins. This preliminary securing action ensures the substrate remains firmly held during subsequent high-speed movements, preventing flying out and damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively prevents substrate sliding, allows high-speed operation, and ensures precise alignment, thereby reducing production time and minimizing substrate damage.
Implementation Method 1
the electromagnetic module applies magnetic force or does not apply magnetic force to the substrate holding member by adopting an electromagnet principle and by energizing and deenergizing the electromagnetic module
Data Source
AI summary
A substrate holding device includes robot arms, wherein the robot arm includes a supporting portion for supporting a substrate; a plurality of substrate holding modules disposed on the robot arm. Each substrate holding module includes a linear guide mechanism, a substrate holding member, and a drive device for driving the substrate holding member to move along the linear guide mechanism between a first position in which the substrate holding member clamps the substrate and a second position in which the substrate holding member releases the substrate.