Robot Hand Heating Element Prevents Wafer Condensation
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Solution Overview
Problem
In semiconductor fabrication facilities, the transfer of wafers from low-temperature, high-vacuum process chambers to atmospheric pressure environments can result in dew condensation or frost formation, damaging thin layers on the wafers, and heating the wafers in transfer chambers decreases production throughput due to the time required for temperature adjustment.
Innovation Solution
A robot hand equipped with a transfer plate, an electrostatic chuck for wafer adsorption, and a heating element that heats the wafer during transfer from a low-temperature, high-vacuum chamber to an atmospheric pressure chamber, ensuring the wafer reaches room temperature before exposure to prevent condensation and reducing heating time in transfer chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wafer is heated in the process chamber or transfer chamber to prevent condensation, then condensation prevention is improved, but production throughput decreases due to heating time
Solution Approach 1:
The heating element is activated during the wafer transfer process itself, performing the heating action in advance before the wafer enters the transfer chamber. This preliminary heating prevents condensation from forming when the wafer is later exposed to atmospheric pressure, eliminating the need for separate heating cycles in the transfer chamber and thereby maintaining production throughput.
Solution Approach 2:
The heating function is merged with the transfer mechanism by integrating the heating element directly into the robot hand that handles the wafer. This combination allows heating to occur simultaneously with the transfer operation, rather than as a separate sequential step, thus preventing condensation without sacrificing productivity.
2Temperature
If the wafer is cooled to low temperature in the process chamber, then fabrication processes are improved, but condensation forms when the wafer is transferred to atmospheric pressure
Solution Approach 1:
The heating element is activated during the wafer transfer process itself, performing the heating action in advance before the wafer enters the transfer chamber. This preliminary heating prevents condensation from forming when the wafer is later exposed to atmospheric pressure, eliminating the need for separate heating cycles in the transfer chamber and thereby maintaining production throughput.
Solution Approach 2:
The system changes the temperature parameter of the wafer dynamically during transfer by activating the heating element. This parameter change occurs in real-time during the transfer operation, allowing the wafer to be heated from its low fabrication temperature to a safe temperature before atmospheric exposure, thus preventing condensation while maintaining fabrication process benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents condensation on wafers by heating them during transfer and increases production throughput by minimizing the time needed for temperature adjustment in transfer chambers.
Implementation Method 1
a heating element configured to heat the loading region of the transfer plate
Implementation Method 2
an electrostatic chuck configured to adsorb the wafer to the loading region of the transfer plate
Data Source
AI summary
A robot hand is provided. The robot hand includes a transfer plate that has a loading region; an electrostatic chuck configured to adsorb a wafer disposed on the loading region of the transfer plate; and a heating element configured to heat the loading region of the transfer plate.