Robotic Arm Gripper Sensor for Semiconductor Chamber Inspection

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Solution Overview

Problem

Modern manufacturing processes, particularly in semiconductor production, rely heavily on human expertise for quality control and maintenance, which can be inefficient and prone to errors due to the lack of automated inspection and adaptive control systems for robotic arms handling sensitive materials and devices.

Innovation Solution

The implementation of gripper hand sensors on robotic arms that collect and analyze sensor data to detect adverse conditions, such as imminent collisions or malfunctions, allowing for real-time adjustments and remediation of robotic arm routines to prevent errors and ensure safe operation within varying semiconductor processing environments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If human expertise is used for quality control and maintenance, then flexibility and adaptability are maintained, but efficiency and consistency deteriorate due to manual inspection limitations

Engineering Contradiction:
Improveinspection efficiencyVSAvoidinspection consistency
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The robotic arm system performs self-inspection and self-correction by using its own sensor data to detect adverse conditions and automatically modify its routine, eliminating the need for external human inspection and enabling continuous autonomous operation with consistent quality control

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The system collects sensor data from the robotic arm's perspective, analyzes it to detect adverse conditions, and uses this feedback to automatically modify the robotic arm routine, creating a closed-loop control system that improves both efficiency and reliability through continuous monitoring and adaptive response

Inventive Principle:
Principle #23Feedback

2Productivity

If automated robotic arm routines are implemented, then productivity increases, but the ability to detect and respond to adverse conditions deteriorates without sensory feedback

Engineering Contradiction:
Improvemanufacturing throughputVSAvoidadverse condition detection
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The sensor system serves multiple functions: it collects environmental data, detects adverse conditions, provides feedback for routine modification, and enables both automated operation and adaptive response, making the robotic arm system universally capable of handling various manufacturing scenarios with improved reliability

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If sensor data collection is added to robotic arms, then adverse condition detection improves, but system complexity increases

Engineering Contradiction:
Improvedetection accuracyVSAvoidsystem architecture
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the sensor, data collection module, analysis module, and robotic arm control into an integrated system where the sensor is positioned on the robotic arm itself, merging detection and control functions into a unified architecture that improves reliability without proportionally increasing complexity

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11101163B2Systems and methods for automated robotic arm sensing
Publication Date: 2021.08.24 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US11101163B2 patent drawing
  • US11101163B2 patent drawing
  • US11101163B2 patent drawing

AI summary

In an embodiment, a system includes: an airlock; a first semiconductor processing chamber, a second semiconductor processing chamber; and a transfer module configured to move a sensor into and out of the first semiconductor processing chamber and the second semiconductor processing chamber, wherein the sensor is configured to: collect sensor data characterizing the first semiconductor processing chamber when within the first semiconductor processing chamber; and collect sensor data characterizing the second semiconductor processing chamber when within the second semiconductor processing chamber, wherein the transfer module, the first semiconductor processing chamber, and the second semiconductor processing chamber are within a controlled internal atmosphere on a first side of the airlock and separated by the airlock from an uncontrolled external atmosphere on a second side of the airlock.