Roller Transfer for Integrated Circuit Alignment
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Solution Overview
Problem
The handling and transfer of thin and flexible integrated circuits (ICs) from a common support to their destination pose challenges due to their delicacy, leading to potential damage and inefficiencies in high-volume manufacturing processes, particularly when using traditional pick-and-place methods which are time-consuming and require precise control.
Innovation Solution
A method involving rollers with removable surface portions, such as elastomeric sheets, to transfer ICs from a common support to a structure with contact pads, where the ICs are picked up and placed in a way that each terminal is brought into electrical contact with a respective contact pad, using a process that includes transferring ICs from a first roller to a second roller and then to the structure, allowing for efficient and precise alignment without the need for individual handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional pick-and-place methods are used to transfer ICs from common support to destination, then individual IC placement can be achieved, but the process becomes time-consuming and laborious for large volumes
Solution Approach 1:
Multiple ICs are picked up simultaneously by a single platen in parallel operations. The platen engages with multiple ICs at once and transfers them to their destination positions in one coordinated action, converting sequential individual transfers into parallel batch transfers, thereby dramatically increasing manufacturing throughput.
Solution Approach 2:
The platen is pre-configured with the correct geometry, size, and engagement features before the transfer operation. The positioning system pre-aligns the platen with the array of ICs on the common support, so that when the transfer begins, all ICs are captured and transferred in a single coordinated motion without requiring real-time adjustment during the operation.
2Productivity
If a larger platen is used to pick up multiple ICs in parallel, then transfer speed increases, but achieving uniform contact pressure and sufficient flatness becomes difficult
Solution Approach 1:
The platen is divided into multiple independent engagement zones or segments, each capable of independently contacting and lifting ICs. This segmentation allows each zone to adapt to local variations in IC positioning and ensures uniform pressure distribution across the entire platen surface, preventing deformation of large or flexible ICs while maintaining parallel transfer capability.
Solution Approach 2:
Different regions of the platen are designed with locally optimized properties such as varying stiffness, contact surface area, or pressure distribution characteristics. This allows the platen to provide appropriate contact pressure for each specific IC position and type, ensuring uniform engagement across the entire array while maintaining the ability to transfer multiple ICs simultaneously.
3Manufacturing precision
If individual IC handling is performed, then precise placement control can be achieved, but the process requires very accurate control and placement of the picking mechanism
Solution Approach 1:
Multiple IC placement operations are merged into a single coordinated platen movement. The platen maintains precise relative positioning with respect to the common support and destination substrate throughout the transfer, achieving accurate placement for all ICs simultaneously through one controlled operation rather than multiple independent positioning actions.
Solution Approach 2:
The platen serves multiple functions: it acts as a common support for multiple ICs during pickup, provides a transfer interface during motion, and serves as a placement tool for depositing ICs at destination positions. This multi-functionality reduces the need for separate specialized tools for each operation, simplifying the overall control system while maintaining precision.
4Ease of operation
If thin and flexible ICs are handled using traditional methods, then individual placement can be achieved, but the ICs are particularly delicate and may be damaged by inappropriate handling
Solution Approach 1:
Multiple delicate ICs are handled simultaneously as a group by the platen, reducing the number of individual handling events. Each IC remains supported by the platen surface throughout the transfer, minimizing exposure to mechanical stresses that could cause damage, while the coordinated motion ensures all ICs are transferred safely in one operation.
Solution Approach 2:
The platen is designed with cushioning or compliant contact surfaces that conform to the shape and flexibility of thin ICs before contact is made. This pre-compliance ensures gentle engagement that prevents damage to delicate IC structures during pickup, transfer, and placement, while still providing sufficient mechanical support for accurate positioning.
Data Source
AI summary
A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller having a removable surface portion; and transferring said ICs from the first roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.