Room-Temperature Curing Sealant for Electronic Components
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Solution Overview
Problem
Existing sealants and fillers for electrical and electronic components cure incompletely at room temperature, resulting in insufficient hardness and reliability issues due to changes in hardness over time.
Innovation Solution
A two-liquid type organopolysiloxane composition curable by hydrosilylation reaction, where the viscosity doubles within 10 minutes and increases 5-fold to 10-fold within another 10 minutes at room temperature, allowing for complete curing and improved reliability by penetrating narrow spaces and filling intricate components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If organopolysiloxane composition is cured at room temperature, then CO2 emissions are reduced, but curing is incomplete and hardness is insufficient
Solution Approach 1:
The patent modifies the chemical composition parameters of the organopolysiloxane system by incorporating specific catalysts and adjusting the ratio of vinyl-containing polysiloxane to hydrogen-containing polysiloxane, enabling the curing reaction to proceed completely at room temperature without compromising hardness or reliability
Solution Approach 2:
The patent creates a composite curing system combining multiple organopolysiloxane components with different functional groups (vinyl, hydrogen, crosslinking agents) and catalysts, which work synergistically to achieve complete curing at room temperature with sufficient hardness and long-term reliability
2Reliability
If organopolysiloxane composition is cured by heating, then curing completeness is improved, but CO2 emissions increase
Solution Approach 1:
The patent replaces the thermal energy input (heating) with a chemically-driven curing mechanism using catalysts and reactive functional groups, allowing the curing reaction to proceed at room temperature through chemical kinetics rather than thermal activation, thereby eliminating CO2 emissions from heating while maintaining curing completeness
3Length of moving object
If sealant viscosity is low, then penetration into narrow spaces is improved, but filling of intricate components is insufficient
Solution Approach 1:
The patent formulates the sealant with appropriate initial viscosity and curing characteristics that enable it to flow dynamically into narrow spaces and intricate components, then progressively increase in viscosity as curing proceeds to ensure complete filling and maintain positional stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures sufficient curing at room temperature, enhancing the reliability and durability of electrical and electronic components by shortening heating operations and protecting against thermal stress, while maintaining impact and heat resistance.
Implementation Method 1
a two or more liquid type organopolysiloxane composition curable by a hydrosilylation reaction
Implementation Method 2
the viscosity of the composition being doubled at room temperature during 10 min. or more from the initial value obtained directly after mixing all the components, and being increased at room temperature from 5-fold to 10-fold of the initial viscosity within another 10 min.
Data Source
AI summary
A sealant or filler of the invention for electrical and electronic components comprises a two or more liquid type organopolysiloxane composition curable by a hydrosilylation reaction, the viscosity of the composition being doubled at room temperature during 10 min. or more from the initial value obtained directly after mixing all the components, and being increased at room temperature from 5-fold to 10-fold of the initial viscosity within another 10 min. The sealant or filler for electrical and electronic components can be cured to a sufficient degree at room temperature and improve reliability of the sealed or filled components.