Rotary Platform Bonding for Large Electronic Devices
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Solution Overview
Problem
Conventional bonding apparatuses with multiple bond heads face challenges in efficiently handling electronic devices with large bonding areas, requiring increased y-axis table range and footprint, which complicates the handling and bonding process.
Innovation Solution
A system utilizing a rotary platform to rotate electronic devices along a horizontal plane, allowing bonding of large electronic devices in multiple stages with separate input and output magazines positioned on one side of the apparatus, thereby avoiding the need for a larger y-axis table range and optimizing space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If separate input and output magazines are placed on one side of the bonding apparatus, then space efficiency is improved, but the magazines require sideways motion that may encroach into space occupied by other components
Solution Approach 1:
The patent repositions the input and output magazines from a side-by-side arrangement requiring lateral motion to an arrangement where both magazines are located at the end of the conveying track, utilizing the longitudinal dimension of the machine. This dimensional reconfiguration eliminates the need for sideways motion that would encroach on component space while maintaining separate input/output functionality.
2Adaptability or versatility
If the y-axis table range is increased to bond large electronic devices, then bonding capability is improved, but the footprint and moving mass of the positioning table increase
Solution Approach 1:
The patent segments the bonding process into multiple passes, where the bonding tool bonds different portions of the electronic device in sequence. The device is repositioned along the conveying track between passes, allowing the bonding tool to access different areas without requiring the positioning table to have a large y-axis range. This segmentation enables bonding of large devices while maintaining a compact machine footprint.
3Productivity
If multiple bond heads are merged onto one platform, then productivity is improved, but handling complexity increases
Solution Approach 1:
The patent merges multiple bond heads onto a single shared platform with a common conveying track and positioning system. Multiple bond heads are arranged to access the same conveying track, allowing electronic devices to be bonded by different heads in sequence or parallel. This merging increases productivity by utilizing multiple bonding tools while the shared infrastructure manages handling complexity through unified control.
Data Source
AI summary
A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the electronic device has been bonded, the electronic device is conveyed to a rotary platform that is rotatable along a substantially horizontal plane. The electronic device is rotated on the rotary platform to change the respective positions of the bonded first portion and unbonded second portion of the electronic device, before the electronic device is conveyed to the bonding tool such that the second portion of the electronic device is located for bonding by the bonding tool. The second portion of the electronic device may then be bonded.