Rotary Table Workpiece Transfer for Printing
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Solution Overview
Problem
Conventional semiconductor and solar cell printing machines face limitations in cycle time and inspection accuracy, particularly with dual-lane line architectures, leading to reduced wafer production efficiency and potential undetected faults due to complex and costly rotary table and in-line feed systems.
Innovation Solution
A compact 'T-stub' rotary table workpiece transfer apparatus with independently rotating platens and belt-driven conveyors allows for single-sided operation, enabling closed-loop print alignment and quality checking without additional modules, achieving high-speed and precise wafer transfer with less mass and inertia.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional rotary table or in-line feed systems are used, then workpiece transfer can be achieved, but cycle time is limited and inspection complexity increases
Solution Approach 1:
The system divides the transfer function into two independent platens (first and second platens) that can operate independently. While one platen is being printed, the other can be loaded or inspected, enabling parallel operations and reducing cycle time. This segmentation allows the system to overcome the sequential limitations of conventional single-platen designs.
Solution Approach 2:
The dual-platen design enables continuous operation where printing, loading, and inspection can occur simultaneously across different platens. The system maintains continuous productive action by eliminating idle waiting time between operations, as one platen is always ready for the next operation while another is being processed.
2Productivity
If dual-lane line architecture is implemented, then production capacity increases, but inspection complexity and cost increase
Solution Approach 1:
The single inspection station serves dual purposes: it inspects workpieces on both the first and second platens. The inspection system is designed to handle alignment verification for incoming workpieces and quality checking of printed workpieces, eliminating the need for separate inspection systems for each lane and reducing overall complexity.
Solution Approach 2:
The system merges the inspection functions for both lanes into a single integrated inspection station. By combining alignment inspection and print quality inspection into one station that can service both platens, the system reduces the number of separate inspection modules needed while maintaining comprehensive inspection capability.
3Measurement precision
If conventional inspection stations are added, then alignment accuracy improves, but line length and cost increase
Solution Approach 1:
The inspection station is integrated within the compact transfer apparatus structure, nesting the inspection function inside the existing footprint rather than adding it as a separate external module. This allows high-precision inspection capability to be achieved without proportionally increasing the overall line length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases wafer production efficiency by optimizing cycle time and improving alignment accuracy, allowing for higher daily output without increasing line length or complexity, while reducing operational costs and detecting faults more effectively.
Implementation Method 1
The present transfer apparatus provides for a simplified belt component transfer system
Data Source
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AI summary
A printing apparatus (1) for printing workpieces (W) comprises a transfer apparatus (4) with a rotary table (6) supporting first and second platens (7, 8) rotatable between a loading position (L) located in-line between input and output lines. The transfer apparatus (4) is operable to cyclically perform first and second movement operations, in which the rotary table (6) rotates to move the first platen (7) from a loading position (L) to a printing position (P) and vice versa. The platens (7, 8) may be rotatable relative to each other.