Rotatable Base Substrate Holding Mechanism for Equal Pressure
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Solution Overview
Problem
Existing substrate holding rotating mechanisms often result in unequal holding pressures due to spindle misalignment or mechanical backlash, leading to unstable substrate rotation and uneven wear of clamp rollers, necessitating frequent maintenance and increased component costs.
Innovation Solution
A substrate holding rotating mechanism with at least three spindles, where the base members are rotatable and equipped with a reciprocating mechanism, allowing for adjustment of clamp roller pressures to ensure equal contact with the substrate, thereby stabilizing rotation and reducing wear on the rollers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spindles are positioned on the same circle to apply equal holding pressures, then stable substrate rotation is achieved, but spindle misalignment or mechanical backlash causes unequal holding pressures
Solution Approach 1:
The base member is designed to be rotatable, allowing the clamp rollers to dynamically adjust their positions relative to the substrate. This rotational adjustment capability enables the system to compensate for spindle misalignment and mechanical backlash, ensuring equal holding pressures are applied even when spindles are not perfectly positioned on the same circle.
2Productivity
If clamp rollers apply unequal holding pressures to the substrate, then substrate processing can proceed, but unstable rotation occurs reducing processing efficiency
Solution Approach 1:
The rotatable base member allows the clamp rollers to dynamically adjust their positions to achieve equal holding pressures on the substrate periphery. This dynamic adjustment ensures stable substrate rotation during processing, maintaining high processing efficiency without the instability that would result from unequal pressures.
3Duration of action of stationary object
If clamp rollers operate with unequal holding pressures, then substrate processing continues, but uneven wear occurs requiring frequent replacement
Solution Approach 1:
The rotatable base member enables the clamp rollers to operate with equal holding pressures on the substrate, which distributes wear uniformly across all rollers. This equal wear distribution extends the service life of the clamp rollers and reduces the frequency of replacements, thereby maintaining a high operating rate without interruption for maintenance.
Data Source
AI summary
A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.