Rotatable Gas Injector for Wafer Film Uniformity Control
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Solution Overview
Problem
The existing batch-type substrate processing apparatus has limitations in controlling the in-plane distribution of film characteristics on substrates due to a fixed injector, resulting in inconsistent gas discharge directions.
Innovation Solution
A substrate processing method involving a rotatable injector with gas holes along its vertical axis, allowing for controlled gas supply direction changes during processing operations to enhance in-plane distribution control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the injector is fixed to the processing container, then the structure is simple and stable, but the in-plane distribution of film characteristics cannot be sufficiently controlled
Solution Approach 1:
The injector is made rotatable around the vertical axis instead of being fixed, allowing the gas discharge direction to be dynamically adjusted during different process operations. This dynamic capability enables control of in-plane distribution of film characteristics while maintaining structural simplicity through a single rotational degree of freedom.
2Manufacturing precision
If the gas discharge direction is constant, then the injector structure is simple, but the in-plane distribution control is insufficient
Solution Approach 1:
The injector transitions from a static configuration with constant gas discharge direction to a dynamic configuration that can rotate around the vertical axis. This enables the gas discharge direction to be adjusted adaptively according to different process requirements, improving in-plane distribution control without excessive complexity.
Data Source
AI summary
A substrate processing method includes supplying processing gas from a plurality of gas holes formed along a longitudinal direction of an injector, which extends in a vertical direction along an inner wall surface of a processing container and is rotatable around a rotational axis extending in the vertical direction, to perform a predetermined process on a substrate accommodated in the processing container. The predetermined process includes a plurality of operations, and a supply direction of the processing gas is changed by rotating the injector in accordance with the operations.