Rotatable Sputter Source for Uniform Film Deposition
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Solution Overview
Problem
Film forming apparatuses face challenges in achieving uniform film formation and efficient film deposition across varying sizes of film formation objects, leading to issues with film thickness distribution, contamination, and increased maintenance due to wasteful film formation on non-target areas.
Innovation Solution
A film forming apparatus with a rotary table and a spinnable sputter source that adjusts the angle of multiple targets relative to the moving path of the film formation object, positioning them parallel or orthogonal based on the object's size to optimize film coverage and reduce contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the size of the film formation object is large relative to the target, then the film coverage area is improved, but the film thickness distribution is degraded
Solution Approach 1:
The sputter source is made rotatable about its own axis, allowing the target orientation to be dynamically adjusted. When the film formation object is large, the sputter source rotates to position the target longitudinally, enabling the entire surface to be covered while maintaining uniform film thickness distribution through optimized target positioning during the substrate rotation.
2Manufacturing precision
If the size of the film formation object is small relative to the target, then the film thickness distribution is improved, but the film formation efficiency is degraded
Solution Approach 1:
The sputter source rotation mechanism allows the target orientation to be adjusted based on substrate size. When the film formation object is small, the sputter source rotates to position the target laterally, reducing the effective target area facing the substrate. This minimizes wasteful film deposition on surrounding surfaces while maintaining uniform film thickness on the small substrate, thereby improving film formation efficiency.
3Area of moving object
If the target is positioned to cover the entire substrate surface, then the film coverage is improved, but the device complexity increases
Solution Approach 1:
Instead of using multiple fixed targets or complex positioning systems, the invention employs a single rotatable sputter source. The rotation capability allows one target to assume different orientations (longitudinal or lateral) to match the substrate size, achieving complete surface coverage without requiring multiple targets or complex mechanical positioning systems.
Solution Approach 2:
The rotatable sputter source provides multi-functionality, serving as both a longitudinal target positioner for large substrates and a lateral target positioner for small substrates. This single component performs multiple functions that would otherwise require separate targeting systems, reducing overall device complexity while maintaining versatility for different substrate sizes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures uniform and efficient film formation across different sizes of objects, reduces wasteful film deposition, and simplifies maintenance by minimizing contamination and target utilization inefficiencies.
Implementation Method 1
a sputter source spinnably provided at a position opposed to a moving path of the holder moved by rotation of the rotary table and holding a plurality of targets
Data Source
AI summary
A film forming apparatus and a film forming method includes: a vacuum chamber; a holder for a film formation object, the holder being rotatably provided in the vacuum chamber; and a sputter source capable of holding a plurality of targets, the sputter source being spinnably provided so that the opposed area of the target with respect to the film formation object can be varied. They can perform uniform and efficient film formation in accordance with the size of a film formation object using a simple configuration, with less possibility of contamination and easy maintenance.