Rotating Gas Nozzles for Plasma Processing Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional plasma processing apparatuses using inductively coupled plasma struggle to properly supply processing gases to meet required processing performance due to limitations in gas discharge positions, which restricts the electromagnetic field and affects processing efficiency.
Innovation Solution
The plasma processing apparatus features gas nozzles protruding from the sidewall towards the center of the processing chamber with rotating mechanisms, allowing for adjustable gas discharge orientations and enhanced gas supply control, including multiple gas discharge holes at the leading and sidewall ends, enabling more effective gas distribution and processing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gas nozzles are installed at limited positions (central portion and periphery) to avoid blocking electromagnetic field, then electromagnetic field induction is maintained, but processing gas cannot be properly supplied to meet required processing performance
Solution Approach 1:
The gas nozzles are made rotatable about their central axes, allowing dynamic adjustment of gas discharge directions. This enables the system to adapt gas supply patterns to different processing requirements while maintaining electromagnetic field effectiveness, resolving the contradiction between field reliability and processing performance
Solution Approach 2:
Multiple gas discharge holes are provided at different locations and orientations on each nozzle (leading end and sidewall). This multi-dimensional gas discharge capability allows simultaneous supply to different regions of the substrate, achieving proper gas distribution without blocking the electromagnetic field
2Productivity
If multiple gas discharge holes are provided at different locations on gas nozzles, then processing gas can be properly supplied to meet required processing performance, but device complexity increases
Solution Approach 1:
Each gas nozzle is designed as a multi-functional component with multiple discharge holes at different locations (leading end and sidewall). This universal nozzle design can supply gas to multiple regions and achieve different processing patterns, reducing the need for additional specialized components while improving processing performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for improved gas supply and processing performance by enabling precise control over gas distribution, generating high-density plasma and effectively meeting the requirements of plasma processes such as etching, thereby enhancing the overall processing efficiency.
Implementation Method 1
generating inductively coupled plasma within the processing chamber by applying a high frequency power to a high frequency antenna
Data Source
AI summary
There is provided a plasma processing apparatus for performing a plasma process on a substrate mounted on a mounting table in a processing chamber by generating inductively coupled plasma within the processing chamber by applying a high frequency power to a high frequency antenna. The apparatus includes a multiple number of gas nozzles protruding from a sidewall of the processing chamber toward a center of the processing chamber in a space above the mounting table, and each gas nozzle has a gas discharge hole at a leading end of the gas nozzle in a protruding direction and a gas discharge hole at a sidewall of the gas nozzle. Further, the apparatus includes a rotation device configured to rotate each of the gas nozzles on each central axis of the gas nozzles and each central axis is extended in the protruding direction of each of the gas nozzles.


