Rotating Shutter Gas Distribution for Substrate Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Substrate processing apparatuses without a rotation mechanism face challenges in uniformly supplying gas to the entire surface of a substrate, as existing solutions rely on rotating the supporting table to ensure even gas distribution.
Innovation Solution
A substrate processing apparatus featuring a shutter with gas output holes arranged on a curved or polygonal line, supported by a rotation shaft and driven by a unit that moves the shutter between regions, allowing gas to be uniformly distributed across the substrate's surface without the need for table rotation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If gas output holes are arranged on a straight line, then the structure is simple, but uniform gas supply to the entire substrate surface cannot be achieved without rotation
Solution Approach 1:
The gas output holes are arranged on a curved line (arc) rather than a straight line. This curved arrangement, combined with the rotational movement of the shutter, enables uniform gas distribution across the entire substrate surface while maintaining structural simplicity and avoiding the need for supporting table rotation.
2Manufacturing precision
If the supporting table is rotated to supply gas uniformly, then gas distribution uniformity is improved, but device complexity increases due to rotation mechanism requirements
Solution Approach 1:
Instead of rotating the supporting table to achieve uniform gas supply, the invention inverts the approach by rotating the shutter (gas supply unit) itself. This transfers the rotation function from the supporting table to the gas supply mechanism, enabling uniform distribution while providing flexibility for apparatuses without supporting table rotation capabilities.
Solution Approach 2:
The shutter is designed to be rotatable about a central axis, transforming from a static gas supply structure to a dynamic one. This rotational capability allows the gas output holes to sweep across the substrate surface, achieving uniform gas supply through controlled movement rather than requiring the entire supporting table to rotate.
3Productivity
If gas output holes are positioned close to the substrate, then gas supply efficiency is improved, but the shutter cannot cover the mounting region when not in use
Solution Approach 1:
The shutter rotates about a central axis positioned at a specific distance from the substrate, creating a circular sweep path for the gas output holes. This rotational dimension allows the gas holes to reach the substrate effectively while the shutter body maintains proper positioning and coverage capability, resolving the conflict between gas supply efficiency and shutter coverage function.
Data Source
AI summary
A substrate processing apparatus includes a supporting table having a mounting region for a substrate. A rotation shaft supporting a shutter extends in a vertical direction. The shutter is moved between a first region above the supporting table and a second region by rotating the rotation shaft about its central axis. The shutter includes a pipe having gas output holes. When the shutter is disposed in the first region, the gas output holes are located outside the mounting region in a rotation direction from the second region toward the first region. The minimum distance between the central axis and the gas output holes is smaller than or equal to the minimum distance between the central axis and the mounting region. The maximum distance between the central axis and the gas output holes is greater than equal to the maximum distance between the central axis and the mounting region.