Roughened Layer Adhesion in Flexible Display Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing display devices with stacked organic and inorganic layers face issues with layer separation, which compromises the barrier properties and reliability of the underlayer in preventing moisture ingress.
Innovation Solution
A structure comprising a first organic layer with a roughened top surface, a first inorganic layer with a roughened bottom surface, a second organic layer with a roughened bottom surface, and a second inorganic layer with a flat top surface, enhancing adhesion between layers through plasma treatment and surface roughening to reduce internal stresses and prevent separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If smooth surfaces are used for stacking organic and inorganic layers, then the manufacturing process is simple, but the layers separate from each other
Solution Approach 1:
The surfaces of the organic and inorganic layers are roughened in advance before stacking, creating micro-protrusions and micro-depressions that will interlock when the layers are combined. This preliminary surface treatment ensures strong adhesion when the layers are stacked, preventing separation without requiring additional bonding processes.
Solution Approach 2:
The surfaces are transformed from flat to rough with curved micro-protrusions and micro-depressions. This curvature creates mechanical interlocking between layers, where the protrusions of one layer fit into the depressions of the adjacent layer, significantly enhancing adhesion strength.
2Reliability
If multiple layers are stacked to improve barrier properties, then moisture protection is enhanced, but internal stresses cause layer separation
Solution Approach 1:
By roughening the surfaces of multiple stacked layers, the patent creates interlocking micro-protrusions and micro-depressions at each interface. This mechanical interlocking compensates for internal stresses that would otherwise cause separation in multi-layer structures, maintaining layer integrity while preserving the enhanced barrier properties of the multi-layer configuration.
Solution Approach 2:
The patent employs a composite structure of alternating organic and inorganic layers, each with roughened surfaces. The combination of different materials with complementary properties (organic layers providing flexibility and inorganic layers providing barrier properties) creates a multi-layer composite that resists moisture while the surface roughening prevents separation.
3Strength
If layers are roughened to improve adhesion, then separation is prevented, but manufacturing complexity increases
Solution Approach 1:
The surface roughening is performed as a preliminary step during the layer fabrication process itself, rather than as a separate post-processing step. This integration into the manufacturing flow minimizes additional complexity while achieving the adhesion enhancement needed to prevent layer separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves adhesion between layers, reduces the likelihood of separation, and enhances the barrier properties of the underlayer, maintaining the integrity of the display device, especially in flexible displays.
Implementation Method 1
enhancing adhesion between layers through plasma treatment and surface roughening
Data Source
AI summary
A display device includes a first organic layer, a first inorganic layer, a second organic layer, a second inorganic layer, and a thin film transistor. The first organic layer has a roughened top surface. The first inorganic layer has a roughened top surface and is disposed to have a roughened bottom surface that is in contact with the roughened top surface of the first organic layer. The second organic layer has a roughened bottom surface that is in contact with the roughened top surface of the first inorganic layer. The second inorganic layer is disposed to be in contact with the top surface of the second organic layer. The thin film transistor is disposed on the top surface of the second inorganic layer.