Sensor Package Structure With Roughened Support Ring for Flare Control
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Solution Overview
Problem
Conventional sensor package structures suffer from light reflection issues, causing flare phenomena at the sensing region of the sensor chip due to light passing through the optical module.
Innovation Solution
A sensor package structure is designed with a substrate, sensor chip, supporting layer, light-permeable layer, and encapsulant, where the supporting layer has an inner roughened surface with an irregular pattern to scatter light, reducing flare effects by creating an enclosed space with the light-permeable layer and sensor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional sensor package structure with glass board and adhesive layer is used, then the structure is simple and easy to manufacture, but light reflection causes flare phenomenon at the sensing region
Solution Approach 1:
The patent applies the 'Blessing in disguise' principle by converting the harmful light reflection that causes flare into a beneficial scattering effect. The inner roughened surface of the supporting layer, with its controlled irregularities, scatters incoming light to prevent concentrated reflections from reaching the sensing region, thereby eliminating flare while maintaining manufacturing simplicity.
Solution Approach 2:
The patent implements 'Local quality' by creating a roughened surface only on the inner surface of the supporting layer where light interaction occurs, while keeping other surfaces smooth. This localized roughening is applied specifically to the carrying region's supporting layer inner surface, providing anti-flare functionality without affecting other structural aspects of the sensor package.
2Device complexity
If a smooth supporting layer is used, then the structure is simple, but light reflection and delamination occur affecting sensor performance
Solution Approach 1:
The patent applies 'Parameter changes' by modifying the surface roughness parameter of the supporting layer's inner surface. The roughness is controlled within specific ranges (Ra 0.03-0.5μm for UV curing, Ra 0.05-1.0μm for injection molding) to optimize light scattering while ensuring complete solidification and preventing delamination, thereby improving reliability without excessive complexity.
Solution Approach 2:
The patent uses the roughened supporting layer surface as an intermediary between the light-permeable layer and the sensor chip. This intermediate roughened surface scatters light before it reaches the sensing region, acting as a mediator that prevents direct light paths and reflections, thereby protecting sensor performance.
3Productivity
If the supporting layer is not completely solidified, then manufacturing is faster, but delamination occurs reducing yield
Solution Approach 1:
The patent applies 'Preliminary action' by pre-forming the roughened surface structure on the supporting layer before final solidification. This pre-formed roughness structure ensures that when the supporting layer is later cured or solidified, the light scattering function is already in place and the structure is primed for complete bonding, preventing delamination while maintaining efficient manufacturing flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The irregular pattern on the supporting layer effectively scatters light, minimizing flare phenomena and increasing the yield of the sensor package structure by preventing delamination between the supporting and light-permeable layers.
Implementation Method 1
The inner roughened surface is configured to scatter light that passes through the light-permeable layer to arrive thereon
Data Source
AI summary
A sensor package structure is provided and includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, a supporting layer having a ring-shape and being sandwiched between the sensor chip and the light-permeable layer, and an encapsulant that is formed on the substrate. The supporting layer has an inner roughened surface being ring-shaped and having an irregular pattern. The light-permeable layer, the inner roughened surface of the supporting layer, and the sensor chip jointly define an enclosed space. The sensor chip, the supporting layer, and the light-permeable layer are embedded in the encapsulant, and at least part of outer surface of the light-permeable layer is exposed from the encapsulant. The inner roughened surface is configured to scatter light passing through the light-permeable layer to arrive thereon.