Rapid Thermal Processing Chamber with Zoned Resistive Heating
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Solution Overview
Problem
Existing rapid thermal processing (RTP) chambers are costly due to high investment requirements and inefficiencies in heating and temperature control, often relying on expensive lamp systems and embedded resistive temperature measurement devices that require frequent replacement and provide non-uniform heating.
Innovation Solution
The RTP chamber design features a substrate support with multiple zones of resistive heaters, a thermally insulating liner, and a reflective plate with pyrometers for direct temperature measurement, allowing for independent zone control and efficient heat containment using aluminum or aluminum alloy components, which reduces costs and improves processing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If lamp systems are used for heating, then rapid heating capability is achieved, but device cost and complexity increase significantly
Solution Approach 1:
The patent replaces the optical lamp heating system with a resistive electrical heating system. The substrate support includes resistive heating elements that directly heat the substrate through electrical resistance, eliminating the need for complex lamp arrays, reflectors, and optical alignment mechanisms while achieving comparable rapid heating rates.
Solution Approach 2:
The patent extracts and removes the lamp system components (lamps, reflectors, optical pathways) from the heating mechanism, retaining only the essential heating function through a simplified resistive heating approach. This extraction eliminates unnecessary complexity while preserving the core heating capability.
2Measurement precision
If embedded temperature measurement devices are used, then temperature control is achieved, but manufacturing cost increases and components require frequent replacement
Solution Approach 1:
The patent uses pyrometers as non-contact temperature measurement devices positioned above the substrate support. These pyrometers measure substrate temperature through thermal radiation without physical contact, serving as an intermediary measurement approach that avoids embedding sensors in the substrate support structure, thereby reducing manufacturing complexity and component replacement needs.
3Manufacturing precision
If multiple heating zones are implemented, then temperature uniformity across substrate improves, but device complexity increases
Solution Approach 1:
The substrate support is divided into multiple independently controllable heating zones with separate resistive heating elements. Each zone can be controlled to achieve uniform temperature distribution across the substrate surface, with segmentation enabling precise local temperature control without requiring an overly complex overall system.
4Loss of energy
If thermally insulating materials are used extensively, then heat containment improves, but chamber weight and manufacturing cost increase
Solution Approach 1:
Thermally insulating materials are applied locally at critical heat loss locations such as the chamber lid and substrate support periphery, rather than throughout the entire chamber structure. This targeted insulation approach effectively reduces heat loss while minimizing the total amount of insulating material required, thereby controlling chamber weight and manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables cost-effective and accurate thermal processing by using conductive heating and direct temperature measurement, reducing the need for frequent component replacement and maintaining chamber integrity through cooling channels, thus providing efficient and precise temperature control.
Implementation Method 1
The substrate support has multiple zones of resistive heaters to heat substrates positioned on the substrate support
Implementation Method 2
A plurality of pyrometers are positioned within the reflective plate to measure the temperature of a substrate at a plurality of locations across the substrate
Implementation Method 3
The chamber lid includes a lid body having an opening therethrough, and a reflective plate disposed within the opening
Implementation Method 4
The chamber body also optionally includes a cooling channel to mitigate thermal stress
Implementation Method 5
a thermally insulating liner disposed therein for containing heat generated during thermal processing
Data Source
AI summary
Embodiments of the invention generally relate to RTP chambers. The chambers generally include a chamber body and chamber lid. The chamber body includes a substrate support having multiple zones of resistive heaters to heat substrates positioned on the substrate support. The chamber body also optionally includes a cooling channel to mitigate thermal stress and a thermally insulating liner disposed therein for containing heat generated during thermal processing. The chamber lid includes a lid body having an opening therethrough, and a reflective plate disposed within the opening. A plurality of pyrometers are positioned within the reflective plate to measure the temperature of a substrate at a plurality of locations across the substrate corresponding to the zones of the substrate support. The temperature of each zone is adjusted in response to the signals from the plurality of pyrometers.