High-Frequency/Infra-Red Heating Baking TRIZ Cases
- EUV Target Nozzle Heating Gradient to Prevent Oxidant Clogging
A hotter nozzle-side heater suppresses oxidant separation in EUV target material, reducing clogging and keeping output direction stable.
- Oscillating Radiant Heat Sources for Wafer Temperature Uniformity
Oscillating radiant heat sources eliminate hot and cold spots by redistributing infrared energy, improving temperature uniformity in CVD processing.
- Rapid Thermal Processing Chamber with Zoned Resistive Heating
Replacing lamp systems with zoned resistive heating and pyrometer feedback reduces device complexity while maintaining accurate temperature uniformity.
- Selective Substrate Heating for Defect Differentiation in Vacuum
Localizing substrate heating via a focused light beam reduces ion oscillation interference, allowing precise differentiation between junction and short defects.
- Laser Processing Shield with Purge Gas for Contamination Control
A laser processing shield uses purge gas flow to remove volatized components and ablated material from the annealing cavity.
- Quartz Dome Curvature for Epitaxial Reactor Flow Uniformity
Angled tangent lines on quartz dome surfaces create flatter geometry to promote uniform gas flow across semiconductor substrates.
- Annular Recessed Chamber for Uniform Semiconductor Wafer Heating
An annular recessed portion in the chamber wall reduces stray light reflection to improve in-plane temperature uniformity during semiconductor wafer heat treatment.
- Microwave Launch Box with Choke Plate for Food Conveyor Ovens
A choke plate and match plate configuration optimizes resonant modes to prevent microwave energy leakage and arcing in conveyor ovens.
- Heating Plate Edge Cooling for Thermal Homogeneity
Gas conveyed through a frame gap cools heating plate edges, reducing center-to-edge temperature differences during substrate thermal treatment.
- Hollow Ceramic Shaft Gastight Mounting via Metal Ring Mediator
A metal ring member mediates tightening forces on a hollow ceramic shaft, preventing breakage while maintaining a reliable gastight seal.
- RF Heating Apparatus Phase Optimization Lookup Table
Radio-frequency heating apparatus adjusts phase and frequency via backward power detection units to optimize energy delivery.
- Matchbox Oven Slider Stoppers Minimize Heat Loss
Dynamic slider stoppers cover oven apertures to prevent heat loss, resolving the trade-off between continuous food throughput and high energy consumption.
- Semiconductor Wafer Oven with Adaptive Heating Zones
Independent heating zones compensate for unpredictable wafer warping during baking, ensuring uniform thermal distribution and reducing manufacturing defects.
- Bake Plate Temperature Control via Face Plate Feedback
A bake plate adjusts heating power using face plate temperature measurements to maintain steady-state wafer processing.
- Silicon Carbide Support Ring for Uniform Semiconductor Wafer Heating
Silicon carbide support ring with inclined members minimizes contact to ensure uniform semiconductor wafer heating and suppresses thermal expansion vibrations.
- Rapid Thermal Processing Lamp Control for Semiconductor Substrate Temperature
A rapid thermal processing apparatus adjusts lamp irradiation intensity based on substrate reflectivity to maintain precise temperature control.
- Edge Ring Temperature Control for Wafer Uniformity
Independent edge ring heating compensates for substrate edge interference, achieving uniform temperature profiles within 1.5°C deviations.