Rugged Flash Memory Storage Thermal Dissipation Design
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Solution Overview
Problem
Current data storage solutions fail to efficiently manage and access vast amounts of data (up to peta bytes) while ensuring ruggedness, security, and high input/output speeds, particularly due to heat dissipation challenges in densely packed electronic configurations.
Innovation Solution
A rugged digital mass storage device design featuring a motherboard with external and flash memory connectors, thermal dissipation assemblies with heat plates and sinks, and a polymer enclosure for protection and security, which effectively manages heat dissipation and shock resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If flash memory cards are densely packed to increase storage capacity, then data storage volume is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent divides the storage system into multiple independent flash memory cards that can be individually thermally managed. Each card is a separate unit with its own thermal dissipation path through the heat sink assembly, allowing heat to be distributed and managed across multiple segments rather than concentrated in a single dense package.
Solution Approach 2:
The patent introduces a heat sink assembly as an intermediary thermal management component between the flash memory cards and the environment. This heat sink acts as a mediator that collects heat from multiple flash memory cards and dissipates it to the surrounding air, enabling dense packing while maintaining acceptable temperature levels.
2Reliability
If the device is enclosed for security and protection, then ruggedness is improved, but thermal dissipation becomes more difficult
Solution Approach 1:
The patent employs a polymer enclosure that provides rugged protection while allowing thermal dissipation. The enclosure shell is designed to protect the internal components from physical damage and environmental factors while maintaining pathways for heat to escape from the heat sink to the external environment.
Solution Approach 2:
The patent converts the potential harm of heat accumulation into a manageable issue by designing the enclosure with intentional thermal pathways. The enclosure that provides protection also facilitates controlled heat dissipation, turning the challenge of thermal management within a protected environment into a solved problem.
3Quantity of substance
If multiple flash memory cards are connected to increase storage capacity, then data storage volume is improved, but device complexity increases
Solution Approach 1:
The patent implements a universal connector design on the motherboard that can accommodate multiple flash memory cards using the same interface and mounting mechanism. This multi-functional connector system allows the device to scale storage capacity by simply adding more cards of the same type, rather than requiring different connector types or complex routing for each card.
Solution Approach 2:
The patent combines multiple flash memory cards into a single unified storage system managed through a common motherboard interface. The thermal management system also merges the heat dissipation pathways of multiple cards into a single heat sink assembly, simplifying the overall device architecture while maintaining high storage capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a secure, rugged, and high-speed data storage system capable of handling large data volumes with efficient thermal management, ensuring longevity and reliability by minimizing the impact of shocks and vibrations.
Implementation Method 1
A thermal dissipation assembly is provided for each flash memory card. The thermal dissipation assembly includes a heat plate with a first end adjacent to the flash memory controller and a second end adjacent to the flash memory.
Implementation Method 2
A heat sink is attached to the flash memory cards at the second end
Implementation Method 3
A heat sink is attached to the flash memory cards at the second end
Data Source
AI summary
An apparatus has a mother board with external connectors on a first side and flash memory connectors on a second side. Flash memory cards are connected to the flash memory connectors. Each flash memory card has flash memory and a flash memory controller. A thermal dissipation assembly is provided for each flash memory card. The thermal dissipation assembly includes a heat plate with a first end adjacent to the flash memory controller and a second end adjacent to the flash memory. A heat sink is attached to the flash memory cards at the second end. A polymer surrounds the external connectors and fully encloses remaining portions of the first side of the mother board, and fully encloses the flash memory cards, the thermal dissipation assembly and the heat sink.