Mass Spectrometry Sample Support With Outgas-Isolating Spacer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing sample supports for mass spectrometry face challenges with outgas generation from the conductive layer and bonding member during manufacturing, leading to noise in mass spectrometry due to the deposition of a mixed layer on the substrate.
Innovation Solution
A sample support design featuring a substrate with through-holes, a first member with openings on one surface, and a second member with corresponding openings on the opposite surface, where the conductive layer is applied from the second member side, preventing outgas deposition and using a bonding member between the members to isolate measurement regions and suppress sample movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the conductive layer is provided on the second surface of the substrate before bonding with the base, then the manufacturing process is simplified, but outgas from the bonding member deposits on the substrate forming a mixed layer that causes noise in mass spectrometry
Solution Approach 1:
The conductive layer is formed on the second surface of the substrate before bonding with the base. This preliminary action allows the conductive layer to be deposited while the substrate surface is still accessible, avoiding the need to disassemble the bonded structure later for conductive layer formation.
Solution Approach 2:
A spacer is introduced as an intermediary component between the substrate and the base. The spacer prevents the bonding member from directly contacting the conductive layer on the second surface of the substrate, thereby preventing outgas deposition on the conductive layer while still allowing the base to be bonded to the substrate through the spacer structure.
2Strength
If the bonding member is applied to bond the substrate and base together, then the structural integrity is improved, but outgas is generated from the bonding member and conductive layer that deposits on the substrate
Solution Approach 1:
The spacer acts as a physical barrier and intermediary between the bonding member and the conductive layer. It allows the bonding member to fulfill its bonding function while preventing direct contact with the conductive layer, thereby eliminating the source of outgas deposition on the substrate surface.
Solution Approach 2:
The harmful interaction between the bonding member and conductive layer is extracted by removing the direct contact pathway. The spacer extracts the bonding function from the direct substrate-base interface and relocates it to a position where outgas cannot contaminate the conductive layer.
3Productivity
If multiple measurement regions are created on the substrate, then the productivity of mass spectrometry is improved, but sample movement between adjacent measurement regions occurs
Solution Approach 1:
The substrate surface is segmented into multiple distinct measurement regions, each capable of independent mass spectrometry analysis. This segmentation increases productivity by allowing parallel or sequential measurement of multiple samples on a single substrate without requiring multiple substrates.
Solution Approach 2:
The bonding member is strategically positioned to occupy and isolate the regions between adjacent measurement regions. By extracting the bonding member placement to these inter-region spaces, physical barriers are created that prevent sample movement between measurement regions while preserving the integrity of each individual measurement region.
Data Source
AI summary
A sample support includes: a substrate having a plurality of through-holes opening on a first surface and on a second surface; a first member having a plurality of first openings and disposed on the first surface; a second member having a plurality of second openings and disposed on the second surface, and; a bonding member disposed between the first member and the second member; and a conductive layer integrally provided on a region of the second surface corresponding to each of the plurality of second openings. The plurality of through-holes include a plurality of first through-holes located between each of the plurality of first openings and each of the plurality of second openings, and a plurality of second through-holes located between the first member and the second member. Each of the plurality of second openings communicate with each of the plurality of first openings through the plurality of first through-holes.