Sample Thinning via Adhesive Framing Substrate
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Solution Overview
Problem
Current chip thinning methods, such as the DBG process, are limited by their dedication to specific plate diameters, contamination risks from metal frames, and damage to chip edges during grinding, restricting versatility and achievable thickness.
Innovation Solution
A process involving a framing substrate with a through-opening that allows simultaneous thinning of the substrate and sample using a grinding wheel, minimizing edge damage and enabling adaptation to various sample sizes and subsequent treatments, while using non-contaminating materials to maintain cleanliness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chips are collectively thinned using a metal frame and adhesive film, then productivity is improved, but contamination risk increases and manufacturing precision deteriorates due to edge damage
Solution Approach 1:
The patent introduces an adhesive layer as an intermediary between the metal frame and the chip. This adhesive layer acts as a protective mediator that prevents direct contact between the grinding wheel and the chip edges, thereby reducing edge damage and contamination while enabling collective thinning operations
Solution Approach 2:
The patent segments the chip into a central active area and peripheral edge areas by introducing an adhesive frame structure. The adhesive layer creates distinct zones where the central region undergoes grinding while the peripheral regions protected by the adhesive frame experience minimal stress and damage
2Object-affected harmful factors
If the metal frame surface is kept well below the chip surface, then contamination is prevented, but device complexity increases and manufacturing precision is compromised
Solution Approach 1:
The patent employs a disposable adhesive frame structure that is inexpensive and can be discarded after use. This eliminates the need for complex, expensive, and meticulously maintained metal frame structures with precisely controlled depth variations, simplifying the overall device while maintaining contamination prevention
Solution Approach 2:
The patent changes the material parameter of the frame from metal to adhesive material. This parameter change allows the frame to be flexible, conformable, and disposable, eliminating the complexity associated with rigid metal frame structures while maintaining the protective function
3Manufacturing precision
If a minimum wafer diameter of 200 mm is used for the DBG process, then manufacturing precision is maintained, but adaptability decreases
Solution Approach 1:
The patent creates a universal thinning system where the adhesive frame structure can accommodate chips of various sizes and configurations. The same basic process and equipment can handle different chip dimensions, making the system multi-functional and adaptable while maintaining manufacturing precision through the consistent adhesive protection mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances versatility, reduces edge defects, and allows for thinner samples with improved flatness, enabling further processing steps like CMP and etching without contamination, and achieving thicknesses below 40 micrometers.
Implementation Method 1
the thinning being carried out by grinding with a grinding wheel
Implementation Method 2
the framing substrate and at least one sample being placed on a rotating platform and held in place by suction
Data Source
Figure 1~7
Figure 8~10
Figure 11~15
AI summary
It comprises the steps of: a) Providing at least one sample having a front face (3) and a rear face (9) opposite the front face (3), b) Providing a framing substrate (100) having a first face (5) and a second face (6) opposite the first face (5), the framing substrate (100) comprising a through-opening (7) opening into the first face (5) and the second face (6), the through-opening (7) being configured to receive the at least one sample, c) Positioning the at least one sample (1) relative to the framing substrate (100) so that the at least one sample (1) is disposed in the through-opening (7), the front face (3) being oriented on the same side as the first face (5), and d) Simultaneously thinning the framing substrate (100) and the at least one sample (1) from the first face (5) and the front face (3) respectively, so that at the end of slimming,the first face (5) of the framing substrate (100) and the front face (3) of at least one sample (1) extend substantially in the same plane, the thinning being carried out by grinding with a grinding wheel, the framing substrate (100) and at least one sample (1) being arranged on a rotating platform and held in place by suction, the sides of at least one sample remaining free during thinning.