Sandwiched Lens Passive Alignment for Optoelectronics

The patent applies preliminary action by pre-aligning the lens with the optical transmission medium during the wafer fabrication process using wafer-scale technologies. The lens is precisely positioned relative to the optical waveguide before the actual assembly, eliminating the need for time-consuming active alignment later. This preliminary positioning is achieved through photolithography and other wafer-level manufacturing techniques that pattern the lens and alignment features simultaneously.

The patent replaces the mechanical active alignment system (which requires energizing light sources and using feedback signals to adjust component positions) with a passive mechanical structure. The lens is fixed in place during fabrication, and alignment is achieved through the physical geometry of the lens holder and its precise registration features, eliminating the need for complex mechanical adjustment mechanisms during assembly.

The patent extracts and removes the complex active alignment system (light sources, feedback signals, adjustment mechanisms) from the final device. Instead, it incorporates a simplified passive alignment structure where the lens is pre-positioned during wafer fabrication with registration features that directly mate with corresponding features on the optical transmission medium, eliminating the need for complex alignment electronics and mechanics.

The patent uses copying by creating identical registration features and geometric patterns during wafer-scale fabrication that replicate the alignment requirements. The lens holder and optical transmission medium both have matching geometric features that ensure precise alignment through simple mechanical mating, copying the precision of active alignment through passive geometric replication.

The patent applies the nested doll principle by placing the lens inside a protective cavity formed in the substrate. The lens is embedded within the substrate material, surrounded by the substrate itself, which acts as a protective enclosure. This nested structure protects the lens from environmental contamination while allowing it to be manufactured using standard wafer-scale techniques where the lens is formed within the substrate matrix.

The patent uses a thin film or cavity structure formed in the substrate to encapsulate and protect the lens. This protective enclosure, formed as a thin film or shallow cavity during wafer fabrication, shields the lens from environmental contaminants while maintaining optical performance, allowing the lens to be protected without requiring complex sealing or packaging operations.