Sapphire Cutting with Laser-Formed Channels and Minimal Coating Damage
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Solution Overview
Problem
Conventional sapphire processing methods are inefficient and result in a large damage area of the coating during direct processing of sapphire composite materials, which affects the quality and strength of the final product.
Innovation Solution
A method and device using a CO2 laser to remove the coating with minimal damage, followed by an ultrafast laser to create restructuring channels within the sapphire, and a second CO2 laser to crack the sapphire along these channels, minimizing coating damage and improving processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If direct processing of sapphire composite material with coating is performed, then processing efficiency is improved, but coating damage area increases
Solution Approach 1:
The processing is divided into three distinct stages: first CO2 laser removes coating, then ultrafast laser creates restructuring channels, and finally second CO2 laser scans to induce cracking. This segmentation allows each laser to perform its specific function optimally, preventing coating damage while maintaining high processing efficiency.
Solution Approach 2:
The ultrafast laser creates restructuring channels in advance before the final cracking step. These pre-formed channels guide where the cracks will propagate, ensuring that the coating damage is minimized and controlled to only the necessary cutting path.
2Manufacturing precision
If conventional sapphire processing process is used, then coating damage is reduced, but processing efficiency decreases
Solution Approach 1:
The patent combines three different laser technologies (CO2 laser, ultrafast laser, and second CO2 laser) into a single integrated processing system. This merging allows simultaneous achievement of precise coating removal and efficient sapphire cutting in one coordinated process, rather than requiring separate conventional processing steps.
Solution Approach 2:
The patent processes sapphire composite material with coating as an integrated structure rather than treating them separately. The multi-laser approach is specifically designed to handle the composite nature of coated sapphire, where each laser interacts differently with the coating and sapphire substrate to achieve both precision and efficiency.
3Productivity
If first CO2 laser removes coating, then coating removal efficiency is improved, but dust and debris generation increases
Solution Approach 1:
The patent introduces gas flow as an intermediary substance between the CO2 laser and the workpiece. This gas flow serves as a mediator that captures and removes dust and debris generated during laser ablation, allowing efficient coating removal while controlling harmful particle generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the damage area of the coating, enhances the processing efficiency, and results in a smoother cutting surface with improved sapphire strength, addressing the inefficiencies and coating damage issues of conventional methods.
Implementation Method 1
focusing a first CO2 laser beam on the coating via a CO2 focusing assembly to remove the coating with a predetermined thickness
Implementation Method 2
focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire
Implementation Method 3
scanning, by a second CO2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels
Data Source
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AI summary
A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO2 laser beam the coating via a CO2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second CO2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.