Laser-Cut Sapphire with Restructuring Channels and Low Coating Damage
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Solution Overview
Problem
Conventional sapphire processing methods are inefficient and result in a large damage area of the coating during direct processing of sapphire composite materials.
Innovation Solution
A method and device utilizing a CO2 laser to remove the coating with minimal damage, followed by an ultrafast laser to create restructuring channels in the sapphire, and a galvanometer-focused CO2 laser to crack the sapphire along these channels, minimizing coating damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If direct processing of sapphire composite material with coating is performed, then processing efficiency is improved, but coating damage area increases
Solution Approach 1:
The processing is divided into three distinct stages: first CO2 laser removes coating along first path, ultrafast laser creates restructuring channels along second path, and second CO2 laser scans to induce cracking. This segmentation allows each laser to perform its specific function optimally, achieving efficient processing while minimizing coating damage through precise path control.
Solution Approach 2:
The ultrafast laser creates restructuring channels in advance along the second path before the final cutting stage. These pre-formed channels guide where the sapphire will crack, allowing the second CO2 laser to simply scan nearby and trigger controlled cracking rather than forcing the sapphire to fracture unpredictably, thus reducing coating damage.
2Ease of manufacture
If conventional sapphire processing method is used, then processing simplicity is maintained, but processing efficiency decreases
Solution Approach 1:
Three different lasers (CO2 laser, ultrafast laser, and second CO2 laser) are employed, each serving a specific function in the processing sequence. The CO2 lasers handle coating removal and crack induction, while the ultrafast laser creates the restructuring channels. This multi-functional approach maintains a systematic process while dramatically improving processing efficiency compared to conventional methods.
3Manufacturing precision
If first CO2 laser removes coating, then coating removal is achieved, but dust and debris are generated
Solution Approach 1:
The dust and debris generated by the first CO2 laser during coating removal are converted into a beneficial dust stream that is directed onto the sapphire surface during the second CO2 laser scanning stage. This dust stream facilitates controlled cracking along the restructuring channels by enhancing the thermal stress effect, thus converting a harmful byproduct into a useful element of the cracking mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the damage area of the coating while achieving efficient cutting of sapphire with a smooth cutting surface, addressing the inefficiencies and coating damage issues of conventional methods.
Implementation Method 1
focusing a first CO2 laser beam the coating via a CO2 focusing assembly to remove the coating with a predetermined thickness extending along a first path
Implementation Method 2
focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire
Implementation Method 3
an ultrafast laser beam focused on the sapphire body to form restructuring channels penetrating through the sapphire
Implementation Method 4
scanning, by the second CO2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels
Data Source
AI summary
A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO2 laser beam the coating via a CO2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second CO2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.