Integrating SAW Filter with Transceiver Housing
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Solution Overview
Problem
Existing designs of surface acoustic wave (SAW) filters and transceivers face challenges such as large area occupation, inability to integrate effectively with other components, signal loss during transmission, and potential signal distortion due to poor quality of printed circuit boards.
Innovation Solution
A component stack method is employed to integrate SAW filters and transceivers, involving a conductive layer on a substrate, a transceiver with an air cavity and gap, and electrical connection via metal leads, encapsulated with a molding compound to form an integrated chip, allowing for reduced size and integration with other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a SAW filter uses a ceramic substrate package with surfaces not in contact, then the performance of the SAW filter is maintained, but the area occupied by the SAW filter becomes too large
Solution Approach 1:
The patent merges the SAW filter with the transceiver by making the transceiver's housing serve as the SAW filter's substrate package. The housing includes a cavity that receives the SAW filter, eliminating the need for a separate ceramic substrate package. This integration reduces the overall area while maintaining the required performance through proper acoustic isolation design.
Solution Approach 2:
The SAW filter is nested within the transceiver housing cavity. The housing acts as an outer container that accommodates the SAW filter component, creating a nested structure where the filter is housed within the transceiver's own structure. This nesting approach minimizes external area while preserving internal component functionality.
2Reliability
If the SAW filter is designed as a separate component, then the performance is maintained, but the integration with other components becomes ineffective
Solution Approach 1:
The patent combines the SAW filter and transceiver into a single integrated assembly where the transceiver housing serves dual purposes as both the transceiver enclosure and the SAW filter substrate package. This merging enables effective integration while maintaining filter performance through designed acoustic isolation features.
3Ease of manufacture
If signals are transmitted through the printed circuit board, then the components can be connected, but signal loss occurs
Solution Approach 1:
The patent extracts the signal transmission path from the printed circuit board and routes it through dedicated transmission lines formed on the housing surface. The housing itself becomes the transmission medium, eliminating the need for PCB-based signal routing and reducing associated signal losses while maintaining ease of connection through integrated metal lead structures.
4Ease of manufacture
If a conventional separate design is used, then the components are simple to manufacture, but the package size cannot be reduced
Solution Approach 1:
The patent merges the housing and substrate package functions into a single component structure. The transceiver housing is designed to directly accommodate the SAW filter without requiring a separate ceramic substrate package, thereby reducing package size while maintaining manufacturing simplicity through integrated construction methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a compact, cost-effective integration that minimizes signal loss and enables the inclusion of other components, enhancing performance and stability compared to conventional designs.
Implementation Method 1
due to the properties of the piezoelectric material in the SAW filter 13
Data Source
AI summary
A method and an apparatus for integrating a surface acoustic wave (SAW) filter and a transceiver are provided to solve the problem of having a large area of the prior-art integration of a SAW filter and a transceiver; wherein a device for integrating a SAW filter and a transceiver is provided and a component stack method is used to accomplish the integration of the SAW filter and the transceiver, and thus besides featuring a low cost and a small area as well as avoiding a signal loss, the invention can further include a design of encapsulating other components and chips, or even suitable to be used for various integrated circuit packaging technologies (such as QFP and BGA, etc.)


