SAW Device Pillar Member Prevents Cavity Collapse
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Solution Overview
Problem
Existing surface acoustic wave devices face issues with cavity collapse during resin molding due to high pressure, particularly in larger cavities, which affects the integrity of the surface acoustic wave element.
Innovation Solution
The electronic component includes a substrate with a support layer, a surface acoustic wave element, a cover layer, and a pillar member that connects the substrate and cover layer without contacting the support layer, preventing deformation and collapse of the space surrounding the surface acoustic wave element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cavity is provided on the surface acoustic wave element to prevent resin contact, then the surface acoustic wave element is protected from resin deformation, but the cavity is prone to collapse under high molding pressure
Solution Approach 1:
The cavity space is segmented by introducing a pillar member that divides the single large cavity into multiple smaller regions. This segmentation prevents the entire cavity from collapsing under pressure, as the pillar provides internal structural support while maintaining the protective separation between the surface acoustic wave element and the resin.
Solution Approach 2:
The pillar member acts as an intermediary structural element within the cavity. It provides mechanical support to maintain cavity integrity under molding pressure, while still allowing the cavity to fulfill its protective function of preventing resin contact with the surface acoustic wave element.
2Reliability
If the cavity volume is increased to provide more protection space, then the surface acoustic wave element has better protection from resin, but the cavity becomes more susceptible to collapse under pressure
Solution Approach 1:
By segmenting the large cavity volume with a pillar member, the invention maintains the overall protection space while preventing collapse. The pillar divides the large volume into smaller sub-volumes that are structurally more stable under pressure, thus resolving the contradiction between needing large protection space and avoiding pressure-induced collapse.
3Reliability
If molding pressure is increased to ensure complete resin coverage, then the resin film provides better protection, but the pressure causes deformation and collapse of the cavity
Solution Approach 1:
The pillar member is pre-installed in the cavity before the resin molding process. This preliminary structural reinforcement ensures that when high molding pressure is applied, the cavity maintains its shape and does not collapse, while still allowing the resin to flow and provide complete coverage.
Solution Approach 2:
The pillar member serves as an intermediary that withstands the molding pressure, allowing the resin to be applied at high pressure for complete coverage without causing cavity collapse. The pillar absorbs and distributes the pressure, protecting the cavity shape while enabling effective resin molding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents the collapse of the space surrounding the surface acoustic wave element during resin molding, ensuring structural integrity and maintaining the desired performance characteristics, such as high radiation performance and improved attenuation and isolation characteristics.
Implementation Method 1
a surface acoustic wave element provided in a predetermined region
Data Source
AI summary
An electronic component includes a support layer that surrounds an element region on a principal surface of a piezoelectric substrate, when viewed in plan from a z-axis direction. A surface acoustic wave element is provided in the element region. A cover layer is provided on the support layer, and is opposed to the principal surface. A pillar member connects the principal surface and the cover layer in a space surrounded by the principal surface, the support layer, and the cover layer, and does not contact with the support layer.