Wireless Substrate Temperature Sensor Using SAW Resonator

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Solution Overview

Problem

Conventional substrate temperature analysis systems are limited by high temperature measurement ranges and physical connections that interfere with manufacturing processes, reducing the degree of freedom in semiconductor manufacturing.

Innovation Solution

A substrate with a sensor unit incorporating a coil or SAW resonator and antenna, allowing for temperature analysis without physical connection to the analysis apparatus, enabling high-temperature operation and maintaining manufacturing process flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a temperature sensor is physically connected to a computer via an optical cable, then the wafer temperature can be measured and analyzed, but the optical cable can interfere with the wafer process and reduce the degree of freedom of the manufacturing process

Engineering Contradiction:
Improvewafer temperature measurementVSAvoiddegree of freedom of manufacturing process
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The patent extracts the temperature sensing function from the physical connection system. The sensor unit is integrated directly into the substrate, and temperature information is transmitted wirelessly via electromagnetic waves, eliminating the optical cable that interferes with the manufacturing process while maintaining temperature measurement capability

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces electromagnetic waves as an intermediary to transmit temperature information from the sensor unit to the analysis apparatus. This mediator replaces the physical optical cable connection, enabling temperature analysis without the mechanical interference that reduced manufacturing process freedom

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the temperature sensor and storage means are arranged as a single unit, then the apparatus structure is simplified, but the upper limit of the wafer temperature that can be measured is limited to around 145°C which is the upper limit of the operable temperature range of the storage means

Engineering Contradiction:
Improveapparatus structureVSAvoidupper limit of operable temperature range
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent segments the temperature measurement system into two independent parts: the sensor unit integrated into the substrate that can withstand high temperatures, and the analysis apparatus that processes the transmitted signals. This separation allows the sensor to operate at high temperatures while the analysis equipment remains in a controlled temperature environment

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces the integrated storage means with a wireless electromagnetic transmission system. Instead of storing temperature data locally in high-temperature storage means, the system transmits temperature information wirelessly to the analysis apparatus, eliminating the temperature constraint on storage components

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate temperature analysis of substrates at high temperatures without reducing the degree of freedom in semiconductor manufacturing processes, raising the upper limit of operable temperature ranges and avoiding physical interference.

Implementation Method 1

the sensor unit includes a coil wound at least once arranged on the surface of the sensor or embedded within and near the surface thereof. An electric current that corresponds to information with respect to the substrate (e.g., the temperature of the substrate or the amount of charge stored in the substrate) flows through the coil.

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

the sensor unit includes: an SAW resonator; and an antenna unit electrically connected to the SAW resonator. In the sensor unit, the electric current, which corresponds to the information with respect to the substrate (e.g., the temperature of the substrate or the amount of charge stored in the substrate) and the direction of which changes according to the resonance frequency of the SAW resonator, flows through the antenna unit.

Methodology Applied
Scientific EffectSurface acoustic wave resonance: Surface Acoustic Wave

Implementation Method 3

the sensor unit includes a coil wound at least once arranged on the surface of the sensor or embedded within and near the surface thereof... an electric current that corresponds to information with respect to the substrate flows through the coil

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS8686743B2Substrate, substrate holding apparatus, analysis apparatus, program, detection system, semiconductor device, display apparatus, and semiconductor manufacturing apparatus
Publication Date: 2014.04.01 SHINKO ELECTRIC IND CO LTD
  • US8686743B2 patent drawing
  • US8686743B2 patent drawing
  • US8686743B2 patent drawing

AI summary

A substrate including a sensor unit, wherein the sensor unit includes a coil wound at least once arranged on the surface of the sensor or embedded within and near the surface thereof. With such an arrangement, an electric current that corresponds to information with respect to the substrate (e.g., the temperature of the substrate or the amount of charge stored in the substrate) flows through the coil.