Schottky Diode Rectification via Asymmetric Carbon Nanotube Electrodes

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Solution Overview

Problem

The preparation of diodes using low-dimensional nano-electronic materials is complex and limited due to the difficulty in doping methods, especially for nano-semiconductor diodes, which hinders their application in thin film transistors.

Innovation Solution

A Schottky diode with an asymmetric structure is developed, utilizing a semiconductor structure such as carbon nanotubes or molybdenum disulfide, where the first electrode is above the semiconductor structure and the second electrode is below, allowing for a simple preparation method without chemical doping or heterojunctions, enabling efficient rectification.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If chemical doping or heterojunction methods are used to prepare nano-semiconductor diodes, then diode functionality can be achieved, but the preparation process becomes complex and application is limited

Engineering Contradiction:
Improvediode functionalityVSAvoidpreparation process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the doping process entirely from the preparation methodology. Instead of using chemical doping or heterojunctions, the invention uses intrinsic semiconductor nanomaterials with metal electrodes to form Schottky barriers, eliminating the complex doping steps while maintaining diode functionality through the metal-semiconductor interface

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the chemical doping mechanism with a physical Schottky barrier formation mechanism. By using metal-semiconductor contacts with appropriate work function differences, the diode rectification property is achieved through physical interface properties rather than chemical modification of the semiconductor bulk

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If conventional doping methods are used for low-dimensional nano-electronic materials, then diodes can be prepared, but the preparation difficulty increases significantly

Engineering Contradiction:
Improvediode preparation feasibilityVSAvoidpreparation ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent removes the doping step entirely from the fabrication process of nano-semiconductor diodes. By relying on Schottky barrier formation at metal-semiconductor interfaces, the invention makes diode preparation as simple as depositing metal electrodes on semiconductor nanomaterials, which is inherently easier than performing chemical doping on low-dimensional materials

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the fundamental mechanism from chemical doping to physical Schottky barrier formation. This parameter change transforms the preparation difficulty by utilizing straightforward physical vapor deposition or sputtering processes for metal electrode formation, avoiding the complex chemical processes required for doping nanostructures

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The Schottky diode achieves a high rectification ratio and can be easily scaled up for production, reducing costs and simplifying the preparation process while maintaining effective performance.

Implementation Method 1

A barrier having a rectifying property is formed in an interface between the noble metal and the semiconductor layer

Methodology Applied
Scientific EffectSchottky barrier: Electrical Resistance

Data Source

PatentUS10381585B2Thin film transistor
Publication Date: 2019.08.13 HON HAI PRECISION INDUSTRY CO LTD
  • US10381585B2 patent drawing
  • US10381585B2 patent drawing
  • US10381585B2 patent drawing

AI summary

A thin film transistor includes a gate electrode, a insulating medium layer and at least one Schottky diode unit. The at least one Schottky diode unit is located on a surface of the insulating medium layer. The at least one Schottky diode unit includes a first electrode, a semiconductor structure and a second electrode. The semiconductor structure comprising a first end and a second end. The first end is laid on the first electrode, the second end is located on the surface of the insulating medium layer. The semiconducting structure includes a carbon nanotube structure. The second electrode is located on the second end.