Scintillator Protective Layer Layout for Radiation Image Quality
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Solution Overview
Problem
The degradation of image quality in radiation imaging apparatuses due to the scattering of light within multiple layers of protective layers formed around scintillators, which are prone to moisture and lead to increased film thickness and distance between the scintillator and sensor substrate.
Innovation Solution
A radiation imaging apparatus where the scintillator is bonded to a sensor substrate using a bonding member, with a configuration of protective layers where the number of layers on one surface is less than or equal to the other surfaces, and a method of manufacturing involving forming protective layers to minimize light scattering and maintain image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers of protective layer are formed around the scintillator, then moisture resistance is improved, but light scattering increases and image quality degrades
Solution Approach 1:
The patent applies different numbers of protective layers to different surfaces of the scintillator based on their specific requirements. The first surface (light emission surface) has fewer protective layers (one layer) to minimize light scattering and maintain image quality, while the second and third surfaces have more layers (two layers each) to provide adequate moisture protection. This local differentiation resolves the contradiction by optimizing protective coverage where needed while preserving optical performance where critical.
2Reliability
If protective layer is formed before bonding scintillator to sensor substrate, then moisture protection is provided, but light scattering within protective layers increases
Solution Approach 1:
The patent segments the protective layer formation process into distinct stages: first forming a protective layer on the light emission surface before bonding, then forming additional protective layers on other surfaces after bonding and separation. This segmentation allows the critical light emission surface to have minimal protective layers, while other surfaces receive additional protection without compromising image quality.
Solution Approach 2:
The patent performs preliminary protective layer formation on the light emission surface before bonding the scintillator to the sensor substrate. This preliminary action provides necessary moisture protection during the bonding process while keeping the protective layer minimal to reduce light scattering. Subsequent protective layers are added to other surfaces after the critical bonding is complete.
3Reliability
If protective layer thickness is increased to prevent deliquescence, then moisture resistance is improved, but distance between scintillator and sensor substrate increases
Solution Approach 1:
The patent applies protective layers with different thicknesses and numbers to different surfaces of the scintillator. The light emission surface has a single thin protective layer that provides moisture resistance while maintaining minimal distance from the sensor substrate. Other surfaces have thicker or multiple layers of protection, achieving the desired balance between moisture protection and optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach effectively suppresses image quality degradation by controlling the number and thickness of protective layers, maintaining high spatial resolution and moisture resistance, and allowing for uniform scintillator distribution on the sensor substrate.
Implementation Method 1
a scintillator configured with: a first surface opposing the sensor substrate via the bonding member and covered by a first protective layer; a second surface disposed on an opposite side of the first surface and covered by a second protective layer; and a third surface connecting the first surface and the second surface and covered by a third protective layer
Data Source
AI summary
A radiation imaging apparatus in which a sensor substrate and a scintillator are bonded by a bonding member, is provided. The scintillator includes a first surface opposing the sensor substrate via the bonding member and covered by a first protective layer, a second surface disposed on an opposite side of the first surface and covered by a second protective layer, and a third surface connecting the first surface and the second surface and covered by a third protective layer. The first protective layer, the second protective layer, and the third protective layer are each configured by one or more layers, and a number of layers of the first protective layer is less than or equal to respective numbers of layers of the second protective layer and the third protective layer.