Integrated Screw Pump Liquid Cooling Module for High-Performance Heat Dissipation
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Solution Overview
Problem
Current liquid cooling systems for information handling systems are limited in their ability to efficiently dissipate heat from high-performance components like CPUs and GPUs, particularly beyond a 360 mm heat exchange with airflow rates below 100 CFM.
Innovation Solution
The integration of a screw pump into a heat exchanger with stacked fins and coolant loop tube cores within the liquid cooling module, which enhances coolant flow rates and heat dissipation by increasing airflow and coolant circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional liquid cooling systems are used with standard heat exchange dimensions, then the system structure remains simple, but the heat dissipation capability is insufficient for high-performance components
Solution Approach 1:
The patent combines multiple cooling channels and heat exchange pathways into an integrated liquid cooling module, merging the coolant flow paths and heat dissipation structures to achieve enhanced heat dissipation capability while maintaining a unified, manageable system architecture
Solution Approach 2:
The patent introduces multi-dimensional coolant flow paths and three-dimensional heat exchange structures within the cooling module, utilizing vertical and horizontal flow channels to increase heat dissipation surface area and efficiency without proportionally increasing system footprint
2Power
If the heat exchange size is increased beyond 360 mm, then heat dissipation performance improves, but the system becomes less adaptable to standard configurations
Solution Approach 1:
The patent divides the cooling system into modular sections with standardized interfaces, allowing the cooling module to be configured in different arrangements and scaled to fit various system sizes while maintaining effective heat dissipation performance through segmented coolant flow paths
3Power
If airflow rate is increased to enhance heat dissipation, then cooling efficiency improves, but energy consumption increases
Solution Approach 1:
The patent utilizes hydraulic principles in the liquid cooling system to achieve efficient heat transfer through optimized coolant flow dynamics, using fluid mechanics to maximize cooling efficiency while minimizing the energy required to drive coolant circulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a 9 to 12% increase in heat dissipation by enhancing coolant flow rates, thereby improving the thermal management capabilities of information handling systems.
Implementation Method 1
an integrated screw pump formed through the coolant loop tube core
Implementation Method 2
a heat exchanger with integrated screw pumps
Implementation Method 3
enhancing coolant flow rates and heat dissipation by increasing airflow
Data Source
AI summary
An information a hardware processor, a memory device, and a power management unit to provide power to the hardware processor and memory device. The information handling system further includes a liquid cooling module comprising a coolant loop tube core, an integrated screw pump formed through the coolant loop tube core, a first manifold including a screw pump drive system to drive the integrated screw pump, and a second manifold, wherein the first manifold, cylindrical cooling loop core, and second manifold hold a coolant therein for the screw pump to pump the coolant from the first manifold and to the second manifold through the coolant loop tube core. The liquid cooling module is thermally coupled to one or more heat-producing components of the information handling system.