Electroplating Seal Apex Cleaning Head for Residue Buildup
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Solution Overview
Problem
Electroplating residues, particularly from Tin (Sn) or Tin-Silver (Sn/Ag) baths, are difficult to remove from electroplating hardware, leading to degradation of equipment and contamination of other plating baths, and pose challenges in maintaining the integrity of electroplating processes.
Innovation Solution
A cleaning apparatus with a specialized cleaning head featuring a base and protrusions, including a sloped portion, is used to rotate and apply both radial and upward forces on the electroplating seal, effectively cleaning the apex region and preventing plate-up on the seal and equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electroplating hardware is used continuously, then productivity is improved, but electroplating residues accumulate on seals causing plate-up and contamination
Solution Approach 1:
The cleaning apparatus performs preliminary cleaning actions on the electroplating seal before residues can cause plate-up and contamination. The protrusion structure proactively removes residues from the seal apex, preventing harmful effects before they occur during continuous electroplating operations.
Solution Approach 2:
The cleaning apparatus enables the electroplating seal to clean itself through the protrusion structure that mechanically removes residues from the seal surface, allowing the seal to maintain its functionality without external intervention or replacement.
2Object-affected harmful factors
If cleaning apparatus is introduced, then seal cleanliness is improved, but device complexity increases
Solution Approach 1:
The cleaning apparatus uses a segmented protrusion structure with distinct functional portions (first protrusion for initial cleaning, second protrusion with sloped and flat portions for apex cleaning). This segmentation allows each portion to perform a specific cleaning function, effectively removing residues while keeping the overall design manageable through modular functionality.
Solution Approach 2:
Instead of cleaning the seal by applying cleaning agents or complex mechanical systems, the invention inverts the approach by using a simple protrusion structure that mechanically scrapes residues off the seal surface through relative motion, achieving cleaning through a fundamentally different, simpler mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus extends the life of the elastomer seal by preventing contamination and plate-up, ensuring the integrity of the electroplating process and reducing residue-related issues in the electroplating equipment.
Implementation Method 1
the apex of the electroplating seal is configured for rotationally sliding along the second protrusion
Implementation Method 2
cleaning the electroplating seal with a pad secured onto at least a first protrusion of the cleaning head
Data Source
AI summary
A cleaning apparatus for semiconductor equipment, the apparatus including a cleaning head having an attachment configured for removing contamination off an electroplating seal, the attachment including a base, a first protrusion located on a first side of the base, and a second protrusion located on a second side of the base opposite the first side, where the second protrusion comprises a flat portion and a sloped portion, wherein the second protrusion is configured to push an apex of the electroplating seal, and where the apex of the electroplating seal is configured for rotationally sliding along the second protrusion.