Semiconductor Seal Ring Bridge Pattern Spacing Layout
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Solution Overview
Problem
Existing semiconductor devices face challenges in maintaining mechanical strength and moisture resistance due to uneven spacing of bridge patterns in the seal ring area, which can lead to reduced reliability and increased susceptibility to cracks during dicing or resin molding.
Innovation Solution
The semiconductor device incorporates a layout design that adjusts the spacing of bridge patterns by using bridge interval adjusting cells, allowing for local relocation of bridge patterns near the center of the chip, ensuring even spacing and maintaining mechanical strength across varying chip sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bridge patterns are evenly spaced at equal intervals according to design rules, then manufacturing precision is improved, but when chip size changes, the spacing cannot be maintained and manufacturing precision deteriorates
Solution Approach 1:
The patent introduces a dynamic adjustment mechanism for bridge pattern spacing. Instead of fixed equal intervals, the spacing is adjusted based on chip size variations. The bridge patterns are relocated to maintain appropriate spacing while adapting to different chip dimensions, resolving the conflict between manufacturing precision and adaptability.
Solution Approach 2:
The patent changes the spacing parameter of bridge patterns dynamically. When chip size changes, the interval between bridge patterns is modified to maintain mechanical strength and prevent cracks. This parameter adjustment allows the design to adapt to different chip sizes while preserving manufacturing precision through controlled spacing variations.
2Strength
If bridge patterns are locally relocated to maintain even spacing, then mechanical strength is improved, but device complexity increases due to additional layout adjustments
Solution Approach 1:
The patent applies local quality by making bridge pattern spacing adjustments only in specific regions where needed. Rather than redesigning the entire layout, the bridge patterns are locally relocated in the seal ring area to maintain mechanical strength while minimizing overall layout complexity. This localized approach preserves simplicity while achieving the strength improvement.
3Reliability
If multiple seal rings with bridge patterns are used to suppress moisture entry and cracks, then reliability is improved, but device complexity increases due to additional structural elements
Solution Approach 1:
The patent makes the bridge patterns multi-functional by designing them to serve both as mechanical strengtheners and as moisture barriers. The same bridge pattern structure that provides mechanical strength also contributes to preventing moisture entry into the seal ring area. This universal function reduces the need for separate protective structures, thereby maintaining reliability while controlling device complexity.
Data Source
AI summary
In a semiconductor device including a seal ring area containing multiple seal rings are coupled to each other at equal intervals via bridge patterns, improper local relocation of bridge patterns may reduce the reliability of the semiconductor device. A semiconductor device has a first group containing a predetermined number of the bridge patterns spaced at a first interval and a second group containing a predetermined number of the bridge patterns spaced at the first interval, the second group being located at a second interval from the first group. The second interval is larger than the first interval.