Semiconductor Seal Ring Noise Immunity via Series LC Filter

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Solution Overview

Problem

Modern integrated circuits with analog/RF blocks are prone to noise interference from digital blocks, necessitating enhanced noise immunity, particularly in semiconductor devices with seal ring structures.

Innovation Solution

Incorporating a series inductor and capacitor connected between the seal ring and ground, with multiple sets of these components and strategically placing them near noise-sensitive components, along with resistors, to improve noise immunity and isolation bandwidth.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a seal ring structure is used in semiconductor devices, then device isolation and structural integrity are improved, but noise coupling between digital and analog/RF blocks increases

Engineering Contradiction:
Improvestructural integrityVSAvoidnoise coupling
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an intermediary circuit connected between the seal ring and ground that acts as a noise filter. This intermediary structure (comprising resistors, capacitors, and inductors) mediates the interaction between the seal ring and ground, blocking noise propagation while preserving the seal ring's structural isolation function.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent extracts the noise filtering function from the seal ring structure itself and implements it through a separate connected circuit. By taking out the noise mitigation function and implementing it independently through an external circuit connected to the seal ring, the original seal ring structure maintains its structural integrity while the extracted noise filtering circuit handles electromagnetic interference.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If noise filtering circuits are added to enhance noise immunity, then noise immunity and isolation bandwidth are improved, but device complexity increases

Engineering Contradiction:
Improvenoise immunityVSAvoidcircuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by implementing noise filtering only at specific critical locations where noise coupling occurs through the seal ring, rather than throughout the entire device. The filtering circuit is locally connected to the seal ring at strategic points, providing noise immunity precisely where needed without unnecessarily complicating the entire device architecture.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes by employing passive components (resistors, capacitors, inductors) with specific values that can be optimized for different frequency ranges. By adjusting these component parameters, the filtering circuit can be tuned to target specific noise frequencies, achieving effective noise immunity through parameter optimization rather than complex active circuitry.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly enhances noise immunity and isolation bandwidth, particularly in specific frequency bands (1 GHz-15 GHz), reducing noise coupling and improving the performance of noise-sensitive blocks.

Implementation Method 1

Incorporating a series inductor and capacitor connected between the seal ring and ground, with multiple sets of these components and strategically placing them near noise-sensitive components, along with resistors, to improve noise immunity and isolation bandwidth

Methodology Applied
Scientific EffectElectromagnetic filtering: Filter (electronic)

Data Source

PatentUS10020251B2Semiconductor device and method fabricating the same
Publication Date: 2018.07.10 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10020251B2 patent drawing
  • US10020251B2 patent drawing
  • US10020251B2 patent drawing

AI summary

According to an exemplary embodiment, a semiconductor device is provided. The semiconductor device includes a first seal ring and a first circuit. The first circuit includes a first capacitor and a first inductor connected in series. The first circuit is connected between the first seal ring and a ground.