Semiconductor Seal Ring Passivation Layer Design
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Solution Overview
Problem
Conventional semiconductor seal rings are susceptible to electrical shorts due to conductive debris and mechanical stress during the die saw process, and their exposure to upper conductive layers increases the risk of contamination, leading to damage and shorts in semiconductor devices.
Innovation Solution
A semiconductor seal ring comprising a plurality of dielectric and conductive layers with an upper passivation layer to insulate the upper conductive layer from debris, and a columnar region structure where the first columnar region, closer to the die saw cut line, is not electrically coupled to the semiconductor device to mitigate contamination and shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the upper conductive layer is exposed to provide structural reinforcement, then the mechanical strength is improved, but the susceptibility to electrical shorts from conductive debris increases
Solution Approach 1:
An upper passivation layer is introduced as an intermediary between the upper conductive layer and the conductive debris generated during the die saw process. This passivation layer acts as a protective barrier that prevents direct contact between the conductive debris and the exposed upper conductive layer, thereby eliminating the electrical short risk while preserving the structural reinforcement benefit of the exposed conductive layer
Solution Approach 2:
The upper passivation layer is implemented as a thin film structure that covers the exposed upper conductive layer. This thin film provides flexible protection against conductive debris while allowing the underlying conductive layer to maintain its structural reinforcement function during the die saw process
2Reliability
If the first columnar region is electrically coupled to the semiconductor device, then the electrical connectivity is improved, but the susceptibility to contamination from conductive debris increases
Solution Approach 1:
The seal ring structure is divided into different columnar regions with different electrical coupling configurations. The first columnar region is deliberately designed to be isolated from the semiconductor device to avoid contamination, while other regions may maintain electrical connectivity. This local differentiation allows the structure to optimize both connectivity and contamination protection in different areas
Solution Approach 2:
The seal ring is segmented into multiple columnar regions with distinct functional characteristics. The first columnar region is separated and isolated from the semiconductor device to serve as a contamination barrier, while other regions can maintain electrical coupling. This segmentation allows the system to simultaneously achieve electrical connectivity where needed and contamination protection where most vulnerable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of electrical shorts and mechanical damage by providing structural reinforcement and electrical insulation, ensuring the integrity of semiconductor devices during the sawing process.
Implementation Method 1
an upper passivation layer is formed over the upper conductive layer. The upper passivation layer is configured to electrically insulate the upper conductive film layer from conductive debris resulting from the die saw process
Implementation Method 2
The semiconductor seal ring comprises a plurality of dielectric layers, such as insulation layers
Data Source
AI summary
Among other things, a semiconductor seal ring and method for forming the same are provided. The semiconductor seal ring comprises a plurality of dielectric layers formed over a semiconductor substrate upon which a semiconductor device is formed. A plurality of conductive layers is arranged among at least some of the plurality of dielectric layers. An upper conductive layer is formed over the plurality of dielectric layers. An upper passivation layer is formed over the upper conductive layer to isolate the upper conductive layer from conductive debris resulting from a die saw process along a die saw cut line. In an example, a first columnar region comprising a first portion of the conductive layers is electrically isolated from the semiconductor device because the first columnar region is disposed relatively close to the die saw cut line and thus can be exposed to conductive debris which can cause undesired short circuits.