Sealed-Cavity Power Converter Cooling for Protected Heat Dissipation
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Solution Overview
Problem
Current heat dissipation solutions for power converters in photovoltaic power generation systems result in poor reliability and limited heat dissipation capability due to exposure of environment-sensitive elements like power semiconductor devices and magnetic elements in cavities with low protection levels, and the use of glue with low thermal conductivity for magnetic elements leads to ineffective heat dissipation as power consumption increases.
Innovation Solution
The power semiconductor device and magnetic element are disposed in a sealed cavity with separate heat dissipation cavities, using heat sinks or heat exchangers for efficient heat dissipation, and incorporating internal circulation fans and rebound structures to maintain cooling even if fans fail.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic element is disposed in metal housing through gluing, then magnetic element is protected, but heat dissipation capability deteriorates due to low thermal conductivity of glue
Solution Approach 1:
The patent divides the housing into two separate cavities: a sealed cavity for protecting environment-sensitive elements (power semiconductor device and magnetic element) and a heat dissipation cavity for efficient heat dissipation. This segmentation allows the protective function and heat dissipation function to be independently optimized without compromising either aspect.
Solution Approach 2:
The patent introduces a heat exchanger as an intermediary between the sealed cavity and the external environment. The heat exchanger transfers heat from the sealed cavity to the heat dissipation cavity, enabling effective heat dissipation while maintaining the sealed protective environment for sensitive components.
2Temperature
If power semiconductor device and magnetic element are exposed in cavity with low protection level, then heat dissipation is improved, but reliability deteriorates due to environmental exposure
Solution Approach 1:
The patent divides the housing into two separate cavities: a sealed cavity for protecting environment-sensitive elements (power semiconductor device and magnetic element) and a heat dissipation cavity for efficient heat dissipation. This segmentation allows the protective function and heat dissipation function to be independently optimized without compromising either aspect.
Solution Approach 2:
The patent introduces a heat exchanger as an intermediary between the sealed cavity and the external environment. The heat exchanger transfers heat from the sealed cavity to the heat dissipation cavity, enabling effective heat dissipation while maintaining the sealed protective environment for sensitive components.
3Temperature
If internal circulation fan is used for heat dissipation, then heat dissipation efficiency is improved, but reliability deteriorates due to fan failure risk
Solution Approach 1:
The patent incorporates rebound structures that can rebound the air duct plate when the internal circulation fan fails. This beforehand cushioning mechanism ensures that the heat dissipation pathway remains open even when the fan fails, preventing complete heat dissipation failure and maintaining system reliability.
Solution Approach 2:
The rebound structure is designed to automatically activate when the fan fails, using the pressure differential created by fan failure to rebound the air duct plate and open the heat dissipation pathway. This self-service mechanism eliminates the need for additional sensors or control systems to detect fan failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and efficiency of heat dissipation by protecting sensitive components and ensuring continuous heat dissipation, even in the event of fan failure.
Implementation Method 1
The power semiconductor device dissipates heat through a first heat sink
Implementation Method 2
cooling fins of the first heat sink are located in the heat dissipation cavity
Implementation Method 3
When the magnetic element dissipates the heat through a first heat exchanger
Implementation Method 4
the first heat exchanger is located in the heat dissipation cavity
Implementation Method 5
incorporating internal circulation fans to maintain cooling even if fans fail
Implementation Method 6
incorporating internal circulation fans and rebound structures to maintain cooling even if fans fail
Data Source
AI summary
A power converter, heat exchangers, heat sinks, and a photovoltaic power generation system, related to the field of heat dissipation. The power converter includes: a power semiconductor device, a magnetic element, a sealed cavity, and a heat dissipation cavity. The power semiconductor device and the magnetic element are disposed in the sealed cavity. The power semiconductor device dissipates heat through a first heat sink, and cooling fins of the first heat sink are located in the heat dissipation cavity. The magnetic element dissipates heat through a second heat sink, and cooling fins of the second heat sink are located in the heat dissipation cavity, Accordingly, reliability and heat dissipation effect of heat dissipation performed by the power converter are improved.