Sealed Dual Membrane Structure Reducing Pillar Count
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Solution Overview
Problem
The sealed dual membrane (SDM) structure in acoustic-electronic devices faces challenges where the reduced pressure causes the dual membranes to collapse, requiring pillars to prevent collapse but these pillars reduce sensitivity.
Innovation Solution
A novel SDM structure with a substrate, dual vibrating membranes, back electrode plates, and a conductor plate unit, where the membranes are mechanically coupled to the conductor plate unit via pillars, forming a capacitor structure to enhance sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If pillars are added between the dual membranes to prevent collapse, then structural stability is improved, but device sensitivity deteriorates
Solution Approach 1:
The patent introduces a conductor plate as an intermediary component between the dual membranes and the back electrode plates. This conductor plate is mechanically coupled to both membranes through pillars, allowing the pillars to serve dual purposes: providing structural support to prevent membrane collapse while simultaneously functioning as part of the capacitive sensing mechanism. The intermediary conductor plate distributes and transmits mechanical pressure from the membranes to the electrode plates, converting mechanical deformation into electrical signals without requiring excessive pillar support.
Solution Approach 2:
The pillars in this invention serve multiple functions simultaneously: (1) providing mechanical support to prevent membrane collapse under reduced pressure, (2) acting as mechanical coupling elements to transfer pressure between membranes and the conductor plate, and (3) functioning as part of the capacitive sensing structure. This multi-functionality reduces the number of pillars needed compared to traditional designs where pillars solely provide structural support, thereby maintaining sensitivity while ensuring stability.
2Measurement precision
If fewer pillars are used between the dual membranes, then device sensitivity is improved, but structural reliability deteriorates
Solution Approach 1:
The conductor plate acts as a mediator that distributes mechanical loads across multiple points. By coupling both membranes to this shared conductor plate, the structure achieves better load distribution and stress dispersion with fewer pillars. The conductor plate reinforces the mechanical coupling between membranes and electrode plates, allowing reduced pillar count while maintaining structural integrity through the distributed load path.
3Reliability
If more pillars are added between the dual membranes, then structural reliability is improved, but device sensitivity deteriorates
Solution Approach 1:
The pillars serve universal functions as both structural support elements and mechanical coupling elements for the capacitive sensing mechanism. This multi-functionality means that each pillar contributes to both reliability and sensitivity, eliminating the need to over-provision pillars for structural support alone. The same pillars that provide mechanical reinforcement also participate in the pressure transmission and signal generation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the number of pillars required, thereby increasing the sensitivity of the device while maintaining structural integrity.
Implementation Method 1
the conductor plate unit forms a capacitor structure with each of the first back electrode plate and the second back electrode plate
Implementation Method 2
the conductor plate unit is configured to receive the mechanical pressure and outputs an electrostatic signal by means of the capacitor structure
Data Source
AI summary
Provided is a sealed dual membrane (SDM) structure and a device including the same. The SDM structure according to the present invention includes a substrate, a first vibrating membrane and a second vibrating membrane disposed on the substrate, which form a sealed cavity together with the substrate, a first back electrode plate and a second back electrode plate disposed between the vibrating membrane and the second vibrating membrane, and a conductor plate unit disposed between the first back electrode plate and the second back electrode plate. The first vibrating membrane and the second vibrating membrane are mechanically coupled to the conductor plate unit, and the conductor plate unit forms a capacitor structure with each of the first back electrode plate and the second back electrode plate. The present invention reduces the number of pillars required in the SDM structure and increases the sensitivity of the device including the SDM.