Sealed Elastomer Bonded Si Electrodes for Reduced Particle Contamination

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Solution Overview

Problem

The existing electrode assemblies in semiconductor etching processes face erosion issues due to plasma exposure, leading to degradation and operational limitations, which affects the performance and longevity of the plasma processing system.

Innovation Solution

The electrode assembly incorporates a backing member with recesses for bonding material, spacers to maintain a gap, and a groove to trap excess material, ensuring the bonding material is confined and protected from plasma exposure, thereby preventing erosion and enhancing operational longevity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If bonding material is used to join electrode and backing member, then mechanical compliance and thermal conduction are improved, but the bonding material is exposed to plasma and radicals causing erosion and particle generation

Engineering Contradiction:

Improvebonding strengthVSAvoidparticle contamination

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The bonding material is extracted from the plasma exposure zone by using recesses in the electrode and/or backing member to contain the bonding material. This separation removes the harmful plasma-radiated bonding material interface while preserving the bonding function, thereby eliminating particle contamination without sacrificing bonding strength.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The electrode and backing member are designed with localized recesses at specific bonding interfaces. These recesses create a non-uniform geometry that confines bonding material to protected zones, applying the local quality principle by modifying only the bonding regions while leaving the rest of the plasma-exposed surfaces unchanged.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If bonding material is exposed to plasma for electrode assembly, then electrical and thermal functions are achieved, but operational lifetime is reduced due to erosion

Engineering Contradiction:

Improvemultiplicity of functionVSAvoidoperational lifetime

Core Design Contradiction:

Adaptability or versatilityVSDuration of action of stationary object

Solution Approach 1:

By extracting the bonding material from plasma exposure through recess containment, the erosion mechanism is eliminated while the bonding material continues to provide mechanical compliance and thermal conduction. This extends the operational lifetime of the electrode assembly without reducing its multifunctional capabilities.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The recess structure provides beforehand protection by containing the bonding material in a shielded position before plasma exposure occurs. This preventive design cushioning prevents direct plasma-bonding material contact, thereby preserving the bonding material integrity throughout the operational lifetime.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If bond material is protected from plasma exposure, then particle contamination is reduced, but the complexity of electrode assembly manufacturing increases

Engineering Contradiction:

Improveperformance stabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The recesses are incorporated only at the specific bonding interfaces where bonding material is applied, rather than redesigning the entire electrode structure. This localized modification maintains manufacturing simplicity while achieving the reliability benefit of protected bonding material.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The electrode and backing member are segmented with recesses that create distinct zones: a protected bonding material containment zone and an exposed plasma-interaction zone. This segmentation allows the bonding material to be isolated from plasma without requiring complete structural redesign, thereby limiting manufacturing complexity increase.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces the erosion of bonding material, leading to extended operational lifetimes and maintaining performance stability during semiconductor substrate processing, minimizing defects like Al ball particle generation.

Implementation Method 1

the bonding material is confined to the at least one recess

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentEP3171393B1Sealed elastomer bonded si electrodes and the like for reduced particle contamination in dielectric etch and method of manufacturing such electrodes

Publication Date: 2019.12.18 LAM RES CORP

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AI summary

Disclosed is an electrode assembly (200) for a plasma reaction chamber used in semiconductor substrate processing comprising a backing member (230) having a bonding surface (227), the backing member (230); an electrode (220) having a lower surface on one side and a bonding surface (225) on the other side; wherein either the backing member (230) or the electrode has a recess. The bonding material (160) is confined to the at least one recess (280) or at least one spacer (281) is provided to maintain a gap between the bonding surfaces of the backing member and the electrode, and a bonding material (160) between the bonding surfaces (225, 282) of the backing member (230) and the electrode (220). A method of manufacturing an electrode assembly is further disclosed.