Sealing Structure for Uniform Optoelectronic Semiconductor Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for producing optoelectronic semiconductor components using injection molding or transfer molding face challenges in achieving uniform surfaces and efficient sealing, particularly when dealing with components of varying heights, leading to non-uniformly shaped surfaces and increased complexity in mold design.
Innovation Solution
The method involves applying a sealing structure that completely surrounds the contact area to prevent the mold material from contacting the electrical contact surfaces, using a sealing structure with higher elasticity than the sealing film to compensate for height tolerances and ensure a dense seal, thereby allowing for the production of components with uniform surfaces and reduced mold complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional injection molding or transfer molding is used without a sealing structure, then the production process is simpler, but the contact areas become contaminated with mold body material and the surfaces are non-uniform
Solution Approach 1:
A sealing structure is applied to the chip carrier before the injection molding or transfer molding process. This sealing structure pre-defines the contact areas and prevents mold body material from contaminating them during subsequent molding operations, thereby achieving uniform surfaces without complex mold designs
Solution Approach 2:
The sealing structure acts as an intermediary element between the chip carrier and the mold body material. It completely surrounds the contact areas and prevents direct contact between the mold material and the electrical contact surfaces, ensuring contamination-free production while maintaining simple mold design
2Reliability
If a sealing structure is applied to surround contact areas, then contact area sealing is improved, but the production process becomes more complex
Solution Approach 1:
The sealing structure is applied in advance to the chip carrier, defining and protecting contact areas before the main molding process begins. This preliminary sealing ensures reliable protection against material contamination while maintaining a straightforward production sequence
Solution Approach 2:
The sealing structure functions as a flexible sealing element that completely surrounds the contact areas. It provides effective sealing against mold body material while being simple to apply and integrate into the production process, balancing reliability with manufacturing ease
3Manufacturing precision
If sealing structure with higher elasticity is used, then compensation for height tolerances is improved, but material selection becomes more restricted
Solution Approach 1:
The sealing structure is designed with higher elasticity compared to conventional sealing films. This parameter change in material properties enables effective compensation for height tolerances in the chip carrier and semiconductor chips, ensuring consistent sealing performance across varying component dimensions
Solution Approach 2:
The sealing structure utilizes flexible material properties to adapt to height variations in the components being sealed. The higher elasticity allows the sealing structure to deform and conform to tolerance variations, maintaining effective sealing without requiring precise dimensional control
Data Source
AI summary
A method of producing optoelectronic semiconductor components includes A) providing a chip carrier with electrical conductor structures on a carrier upper side, B) applying at least one semi-conductor chip configured to produce light on at least one of the electrical conductor structures, C) applying at least one sealing structure to at least one of the electrical conductor structures so that the sealing structure completely surrounds at least one contact area when viewed from the top, and D) producing a mold body directly at the at least one semiconductor chip and directly at the at least one sealing structure by transfer molding or injection molding, wherein, in an injection mold, the at least one sealing structure seals the at least one contact area against a material of the mold body so that the at least one contact area remains free of the mold body.